Jae-Wan Choi, Jeung-Mo Kang, Jae-Wook Kim, Jeong-Hyeon Choi, Du-Hyun Kim, Geun-ho Kim, Yong-Seon Song, Y. Won, Jeong‐Soo Lee
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Thermal analysis of wafer-level LED packages with multichips
Thermal analysis of wafer-level packaged LEDs with red, green and blue multi-chips are investigated. With Si-MEMS technology, wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process. In this paper, thermal characteristics of wafer-level packaged white LEDs with multi-chips are investigated using both serial and matrix measurement methods.
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