GaInN led:固态照明的直接方式

U. Zehnder, B. Hahn, J. Baur, M. Peter, S. Bader, H. Lugauer, A. Weimar
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引用次数: 7

摘要

新一代基于ingan的薄膜芯片的效率达到110/lm/W,在20ma (5mm径向灯,438nm,芯片尺寸为255 × 460)下的输出功率为32 mW。由于ThinGaN概念芯片的可扩展性,其亮度和效率可扩展到更大的芯片尺寸:1 mm2 ThinGaN Power芯片在350 mA时达到的亮度为495mW (445nm)和202mW或100 lm (527nm)。含磷白光LED在350mA下达到102 lm,安装在OSTAR模块中,带有6个LED芯片,在1000 mA驱动电流下达到1200 lm。实现了620lm (5x 1mm2芯片,700mA)、41 MCd/m2的白光汽车前照灯模块,以及驱动电流为2A/mm2、芯片面积为12mm2、57 MCd/m2的绿色发光投影模块。这些技术的改进表明了gainn - led在固态照明领域的发展方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
GaInN LEDs: straight way for solid state lighting
With the new Generation of InGaN-based thinfilm Chips efficacies of 110/lm/W and output power of 32 mW at 20 mA (5 mm Radial lamp, 438nm, chip-size 255&mgr;m x 460&mgr;m) are reached. Due to the scalability of the ThinGaN concept chip brightness and efficiency are scalable to larger chip sizes: the brightness achieved for a 1 mm2 ThinGaN Power chip at 350 mA were 495mW (445nm) and 202mW or 100 lm (527nm). White LEDs with phosphorus achieved 102 lm at 350mA, mounted in an OSTAR module with six LED chips 1200 lm were demonstrated at 1000 mA driving current. White emitting automotive headlamp modules with 620lm (5x 1mm2 chip at 700mA) and 41 MCd/m2 as well as green emitting projection modules with 57 MCd/m2 at 2A/mm2 drive current and 12mm2 chip area are realized. These technological improvements demonstrate the straight way of GaInN-LEDs for Solid State lighting.
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