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IEEE 1991 International Symposium on Electromagnetic Compatibility最新文献

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Methodology and decision making during high confidence system level EMC analysis 高置信度系统级电磁兼容性分析的方法和决策
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148212
G. Freyer, J. Osburn
{"title":"Methodology and decision making during high confidence system level EMC analysis","authors":"G. Freyer, J. Osburn","doi":"10.1109/ISEMC.1991.148212","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148212","url":null,"abstract":"The management and technical issues encountered in producing a high confidence electromagnetic compatibility (EMC) analysis for a complex system when MIL-E-6051 safety margins are demonstrated without the benefit of a system level EMC test are discussed. The successful approach (involving application of validated, system level EMC analysis codes) provided acceptable, high confidence predictions of ordnance (-20 dB) and nonordnance (-6 dB) safety margins. The type of system, the compliance specifications, and other pertinent technical and management information are described. The most significant ground rules applied to the analysis were redundancy of analytical approaches and independent review of all phases of the activity. The managerial issues and decisions required at various phases the process are described. A structured, disciplined approach and the methodology for comparing, evaluating, and resolving the predictions from two different system level codes are presented.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115318606","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Teaching electromagnetic compatibility at the graduate level 在研究生阶段教授电磁兼容性
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148245
R. Perez
{"title":"Teaching electromagnetic compatibility at the graduate level","authors":"R. Perez","doi":"10.1109/ISEMC.1991.148245","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148245","url":null,"abstract":"Graduate-level education is probably one of the best places to fit an advanced electromagnetic compatibility (EMC) course. To bring interest into a graduate level electromagnetic compatibility course, the material presented should incorporate novel approaches beyond the traditionally taught subjects. In this discussion, the computer age is brought into the teaching of this subject. This is accomplished by examining some of the most successful codes developed for EMC to study their different modeling techniques. Students are introduced to the physics and functionality of several electromagnetic analysis codes which can be useful in EMC analyses. A basic course in EMC would serve as a prerequisite.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116432952","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Shielding effectiveness estimation using matrices 基于矩阵的屏蔽效能估计
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148198
C.L. Smith
{"title":"Shielding effectiveness estimation using matrices","authors":"C.L. Smith","doi":"10.1109/ISEMC.1991.148198","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148198","url":null,"abstract":"An approach to the determination of shielding effectiveness using a formalism originally developed for dielectric sandwich electromagnetic walls is briefly reported. Walls composed of metal skins are essentially impervious, since even fairly light materials are many skin depths thick. The lighter materials, paints and films, are both much thinner and the conductivity is only a few tens of Siemens. Consequently, the shielding effectiveness will be more limited, but still adequate. The theory is presented, and the cascade of matrices required in the solution is discussed.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116536181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Overview on design techniques for printed circuit board layout used in high technology products 高新技术产品印刷电路板布局设计技术综述
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148185
M. Montrose
{"title":"Overview on design techniques for printed circuit board layout used in high technology products","authors":"M. Montrose","doi":"10.1109/ISEMC.1991.148185","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148185","url":null,"abstract":"Computers used in current information technology equipment generate higher clock speeds than similar state-of-the-art products developed only a few years ago. Design techniques commonly used in the past have become insufficient for suppression of electromagnetic interference (EMI) at the printed-circuit level and, perhaps, for basic functional signal quality as well. An overview using a hands-on approach to solving radio frequency (RF) emissions on printed circuit boards is presented. Implementing the items presented will help reduce RF generated on the printed circuit board. Suppression of RF energy at the printed-circuit-board level minimizes costly containment schemes.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114165360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
An investigation of test approaches to CE07 of MIL-STD-461 MIL-STD-461中CE07测试方法的探讨
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148253
M. Massaro, S. Banerjee
{"title":"An investigation of test approaches to CE07 of MIL-STD-461","authors":"M. Massaro, S. Banerjee","doi":"10.1109/ISEMC.1991.148253","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148253","url":null,"abstract":"The various test approaches to CE07 of MIL-STD-461 are examined. The CE07 (EMI) specification requires the measurement of short duration voltage transients produced by equipment onto their power supply lines. In particular, the effects of various types of line impedance stabilization networks (LISNs) on the measurement process are investigated. Time domain responses using three different LISNs are obtained for those cases in which the equipment being tested or the power source generated fast voltage transients. The advantages and disadvantages of using LISNs in the test process are discussed, as well as those test approaches that can avoid erroneous test results. The specialized test equipment needed to perform the test is discussed. The results presented can be used to determine the LISN configuration which produces the minimum amount of measurement distortion.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129822770","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Some fundamental aspects of ESD testing ESD测试的一些基本方面
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148226
R. Keenan, L. A. Rosi
{"title":"Some fundamental aspects of ESD testing","authors":"R. Keenan, L. A. Rosi","doi":"10.1109/ISEMC.1991.148226","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148226","url":null,"abstract":"Transmission line and antenna views of electrostatic discharge (ESD) testing are presented. It is determined that positioning of an ESD gun's ground strap and the mechanical design of an ESD gun and ground strap affect the rise time of current injected into equipment during ESD testing. That rise time affects voltage induced in circuit loops, the dominant cause of ESD-induced upsets in fielded equipment. Ground strap positioning also affects the ESD-induced electromagnetic field in the interior of unshielded equipment, with closer positioning parallel to the gun rod reducing test severity.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128204975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 28
A strip-line TEM cell for measuring electromagnetic emissions 用于测量电磁辐射的带状线 TEM 单元
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148173
J.D. Gavenda, M. Foegelle
{"title":"A strip-line TEM cell for measuring electromagnetic emissions","authors":"J.D. Gavenda, M. Foegelle","doi":"10.1109/ISEMC.1991.148173","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148173","url":null,"abstract":"The results of preliminary measurements of the properties of two stripline transverse electromagnetic (TEM) cells are presented. The construction of the field cell is illustrated schematically. Measurements of emissions from a standard source made in a stripline TEM cell show good correlation with measurements of the same source made in a semi-anechoic chamber. The stripline TEM cell has several practical advantages over the coax TEM cell for preliminary measurements of electromagnetic emissions. These include lower cost, more convenient access, smaller size for a given working volume, and greater uniformity of response across the width of the cell. Its major disadvantage is greater susceptibility to ambient signals, but this can be overcome by using a shielded or partially shielded room.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130352934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Degradation of EM shielding effectiveness due to resonance in the low frequency region 低频共振对电磁屏蔽效能的影响
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148195
Y. Seki, S. Nitta
{"title":"Degradation of EM shielding effectiveness due to resonance in the low frequency region","authors":"Y. Seki, S. Nitta","doi":"10.1109/ISEMC.1991.148195","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148195","url":null,"abstract":"The degradation mechanism of shielding effectiveness in the low frequency range, which cannot be understood from the waveguide model, is clarified. The extreme points in the quasi-near field are shown on an intrinsic impedance characteristics curve and the resonance phenomena on extreme points, and it is proven experimentally and statistically that the remarkable degradation of shielding effectiveness at these resonance points occurs in the shielded enclosures.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123523168","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of environmental testing on the surface transfer impedance/EMP response of cable assemblies with metal banded braid terminations 环境试验对金属带状编织终端电缆组件表面传递阻抗/EMP响应的影响
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148181
L. Hoeft, J. Hofstra, G.L. Dibble
{"title":"Effects of environmental testing on the surface transfer impedance/EMP response of cable assemblies with metal banded braid terminations","authors":"L. Hoeft, J. Hofstra, G.L. Dibble","doi":"10.1109/ISEMC.1991.148181","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148181","url":null,"abstract":"The surface transfer impedance and electromagnetic pulse (EMP) response of two sets of samples were measured before and after a series of environmental tests. Each sample consisted of 1 m of multiconductor cable terminated to a backshell which in turn was mounted on a MIL-C-81511 connector. The surface transfer impedance and the EMP response were measured using the procedures of MIL-C-24640 and MIL-C-85485A, modified to accommodate cable assemblies rather than samples of cables. Samples that used a metal band method of braid termination and samples that used a Metcal solder strap braid termination were evaluated and compared. The effects that mechanical and thermal environmental testing had on the integrity of the electromagnetic shielding are described. This testing was meant to simulate the adverse treatment that an interconnect system might receive during its lifetime. The results of the measurements are presented.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121663863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
System ESD immunity through gate array design 系统ESD抗扰度通过门阵列设计
IEEE 1991 International Symposium on Electromagnetic Compatibility Pub Date : 1991-08-12 DOI: 10.1109/ISEMC.1991.148230
S. Wong
{"title":"System ESD immunity through gate array design","authors":"S. Wong","doi":"10.1109/ISEMC.1991.148230","DOIUrl":"https://doi.org/10.1109/ISEMC.1991.148230","url":null,"abstract":"A major source of today's electronic system electrostatic discharge (ESD) failure mechanism is the EM field radiation interference from ESD. The conventional ways to harden the system immunity against this electromagnetic interference (EMI) field susceptibility include shielding, ground bonding, noise pickup circuit loop reduction, noise decoupling, and suppression. The case presented involves resolving a desktop computer system ESD susceptibility problem by using circuit design changes to custom gate array ICs to achieve the system ESD immunity.<<ETX>>","PeriodicalId":243730,"journal":{"name":"IEEE 1991 International Symposium on Electromagnetic Compatibility","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-08-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127633229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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