Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium最新文献_第6页

Product-oriented BGA manufacturability and reliability study 面向产品的BGA可制造性和可靠性研究

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626944

B. Oberlin, T. Chung

引用次数: 0

Heel cracking induced by the steep conversion of EMC in large QFP 大QFP中电磁兼容陡转引起的足跟开裂

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626906

Y.M. Lee, J. Cho, Y. Sun, N. Kim

{"title":"Heel cracking induced by the steep conversion of EMC in large QFP","authors":"Y.M. Lee, J. Cho, Y. Sun, N. Kim","doi":"10.1109/IEMT.1997.626906","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626906","url":null,"abstract":"Bonding wire heel crack observed in large QFP was studied. From the analysis, it was found that this type of open failure was caused by heel crack at stitch bond during molding. The mold simulation was conducted for quantitative analysis. The software considers the polymerization kinetics of EMC since the mold flow depends on thermal excursion. According to simulation, it was proven that the EMC near gate shrinks with very steep gradient of conversion rate. At this moment the chemical shrinkage of EMC results in the fracture of Au wire due to the excessive tension. The mold simulation analysis coincides with experimental results. Both wire bonding and molding parameters were optimized to solve the heel crack problem. The heel crack resistance could be improved by using a capillary which makes large cross-sectional area of stitch bond. The other solution to suppress the heel crack was to use EMC having a smaller chemical shrinkage. Also an additional improvement was obtained by decreasing molding temperature from 175/spl deg/C to 168/spl deg/C. Conclusively, the chemical shrinkage of EMC is an important property and needs to be reduced to minimize the transfer molding failures, especially for the large body size packages.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127222423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

An organic and ceramic laminated BGA package with high thermal and electrical performance characteristics 一种有机和陶瓷层压BGA封装，具有高热学和电学性能

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626950

H. Asai, K. Yano, K. Iyogi, N. Iwase, T. Fujiwara

{"title":"An organic and ceramic laminated BGA package with high thermal and electrical performance characteristics","authors":"H. Asai, K. Yano, K. Iyogi, N. Iwase, T. Fujiwara","doi":"10.1109/IEMT.1997.626950","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626950","url":null,"abstract":"A new structural face-up LSI package has been developed. The package shows low thermal resistance without a heatsink and low inductance, capacitance, and resistance values. The package is thin enough for portable multimedia equipment applications, with a thickness of 0.5 mn (not including ball height). The measured thermal resistance was 11/spl deg/C/W under natural convection without a heatsink. The simulated inductance and capacitance were 6.7 nH and 1.1 pF respectively, and measured resistance was 520 m/spl Omega/ (line length=14.7 mm, width=60 /spl mu/m). The package consists of a resin film and a ceramic substrate. The film is a liquid crystal polymer (LCP) and the substrate is aluminum nitride (AlN). LCP is a suitable material for buried-bump interconnection technology (B2it/sup TM/). AlN has high thermal conductivity and its coefficient of thermal expansion (CTE) is close to that of silicon. Both materials were laminated by an adhesive agent. This material combination provides a thin structure, low thermal resistance, and low LCR which are suitable for portable multimedia electrical equipment. This paper reports the configuration and performance characteristics of this newly developed package.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127853515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Addressing environment, health and safety in semiconductor process development 解决半导体工艺开发中的环境、健康和安全问题

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626888

L. Mendicino, L. Beu

{"title":"Addressing environment, health and safety in semiconductor process development","authors":"L. Mendicino, L. Beu","doi":"10.1109/IEMT.1997.626888","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626888","url":null,"abstract":"Motorola has traditionally focused on cost, yield, performance, and logistics as primary drivers for decision-making. In the semiconductor industry, environment, health and safety (EHS) issues have resulted in major modifications of tools and process steps, as well as the addition of environmental controls to the facility, because they are not routinely considered when making process design and manufacturing choices, nor is their impact on cost, yield, and cycle time. Certain business driving forces, such as cost, sustainability of processes/tools, time to market, market access, and market share, are leading Motorola to a cultural change in which EHS impacts must be considered during product and process design; however, design and process engineers have not been able to adequately address these impacts. Motorola's Advanced Process Research and Development Laboratory (APRDL) in the Semiconductor Product Sector (SPS) has recognized this and has established its own environmental group (separate from the site EHS compliance group) to implement a Design for EHS (DFEHS) strategy. The APRDL environmental group works with several project teams to address EHS issues in process development. These teams have been investigating copper metallization, wet cleans processes and tools, and other areas to ensure that the long-term EHS implications are identified and addressed before a process is transferred or a tool set recommended to a manufacturing fab. To empower engineers to consider, on their own, the EHS impacts of their materials and processes at the earliest possible stage, the APRDL environmental group has developed a DFEHS training course. This self-instructed, web-based course targets semiconductor design and process engineers and is available through Motorola University, the corporate training institution. The group has also established a procedure for approving new materials for the development lab in which EHS criteria are included.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126915583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

The study of the response of solder pastes under sinusoidal vibration 锡膏在正弦振动下的响应研究

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626872

D. He, Nduka Nnamdi (Ndy) Ekere, M. A. Currie

引用次数: 0

Decomposition procedures for global scheduling of complex job shops 复杂作业车间全局调度的分解程序

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626955

R. Uzsoy, Cheng-Shuo Wang

引用次数: 6

Speeding populated board inspection: a new technology 加速人口板检查:一项新技术

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626932

T. Eskridge, M. DeYong, John W. Grace, Jeff E. Newberry

{"title":"Speeding populated board inspection: a new technology","authors":"T. Eskridge, M. DeYong, John W. Grace, Jeff E. Newberry","doi":"10.1109/IEMT.1997.626932","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626932","url":null,"abstract":"The need for automated populated board inspection stems from the desire to reduce the number of defective board escapes, and to improve the yield of the production line. There are two main goals of populated board inspection: (1) to detect and classify defects, (2) provide process control information. Although at first glance the goals may appear to be independent, they are actually very closely related through the technology used to perform populated board inspection. The current generation of inspection technology typically trades classification accuracy-and hence the ability to provide meaningful process control information-with detection ability and ease of implementation. So while the current generation of technologies may be able to detect a wide range of anomalies on the populated board, detection is not the same as classification. Detection without robust classification will not lead to improved production yields because the information needed to improve the process will not be collected. In this paper we briefly overview the current generation of inspection technology, presenting its weaknesses with respect to the two stated goals. In order to address these goals, a new approach to populated board inspection is described.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122467761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Thermo-mechanical deformation of underfilled flip-chip packaging 未填充倒装芯片封装的热机械变形

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626939

X. Dai, P. Ho

引用次数: 24

Recipe generation for large-area meniscus coating using Kalman filter estimation 基于卡尔曼滤波估计的大面积半月板涂层配方生成

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626880

A. Krauss, E. Kamen, C. M. Chng, A. C. Thé

引用次数: 1

Development of an ultra low moisture polymer adhesive for die attach applications 超低水分聚合物粘接模用胶粘剂的研制

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626925

M. Nguyen, I. Chien

{"title":"Development of an ultra low moisture polymer adhesive for die attach applications","authors":"M. Nguyen, I. Chien","doi":"10.1109/IEMT.1997.626925","DOIUrl":"https://doi.org/10.1109/IEMT.1997.626925","url":null,"abstract":"A new type of die attach material based on a modified olefin thermoset polymer has been developed. Due to its hydrophobic molecular structure, moisture absorption is inherently very low. For example, it absorbs less than 0.05% moisture at 85/spl deg/C/85% RH/168 hrs. Even in HAST test (150/spl deg/C/85% RH/168 hrs.), moisture content is only 0.1%. The olefinic polymer is formulated as a low stress, electrical and thermally conducting paste adhesive. Its other principal features include good processability, less resin bleed and low temperature cure. The new die attach candidates were evaluated using 208 LD PQFP packages with standard epoxy molding compounds. This type of package passed moisture reliability tests at level 3. At JEDEC level 1, there were still package cracks and delaminations at the mold compound interfaces. However, no die attach delamination was observed. These studies clearly demonstrated the need for replacing conventional epoxies with low moisture absorbing polymers for die attachment and encapsulation in order to produce moisture insensitive packages. In summary, the new olefinic thermoset adhesives have shown promise for many die attach applications. These materials will provide important process and reliability improvement for advanced device packaging.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133240496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3