Product-oriented BGA manufacturability and reliability study

B. Oberlin, T. Chung
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Abstract

Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.
面向产品的BGA可制造性和可靠性研究
自1993年以来,已经发表了许多与BGA板级可制造性和可靠性相关的论文。其中许多都是基于简单且非面向产品的测试板。相信以产品为导向的BGA测试车设计,在生产环境中组装,将为BGA封装用户提供更直接的适用信息,从而提高利用BGA技术的产品的可制造性和可靠性。
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