面向产品的BGA可制造性和可靠性研究

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626944

B. Oberlin, T. Chung

{"title":"面向产品的BGA可制造性和可靠性研究","authors":"B. Oberlin, T. Chung","doi":"10.1109/IEMT.1997.626944","DOIUrl":null,"url":null,"abstract":"Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Product-oriented BGA manufacturability and reliability study\",\"authors\":\"B. Oberlin, T. Chung\",\"doi\":\"10.1109/IEMT.1997.626944\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.\",\"PeriodicalId\":227971,\"journal\":{\"name\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1997.626944\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1997.626944","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

自1993年以来，已经发表了许多与BGA板级可制造性和可靠性相关的论文。其中许多都是基于简单且非面向产品的测试板。相信以产品为导向的BGA测试车设计，在生产环境中组装，将为BGA封装用户提供更直接的适用信息，从而提高利用BGA技术的产品的可制造性和可靠性。

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Product-oriented BGA manufacturability and reliability study

Since 1993, many BGA board level manufacturability and reliability related papers have been published. Many of them were based on simple and non-product-oriented test boards. It is believed that a product-oriented BGA test vehicle design, assembled in a production environment, will provide more direct applicable information to BGA package users, and thus improve manufacturability and reliability of products utilizing BGA technology.

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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