2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)最新文献

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Sub-Nanosecond Delay CMOS Active Gate Driver for Closed-Loop $mathrm{d}v/mathrm{d}t$ Control of GaN Transistors GaN晶体管的亚纳秒延迟CMOS有源栅极驱动器的闭环控制
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757693
Plinio Bau, M. Cousineau, B. Cougo, F. Richardeau, S. Vinnac, D. Flumian, N. Rouger
{"title":"Sub-Nanosecond Delay CMOS Active Gate Driver for Closed-Loop $mathrm{d}v/mathrm{d}t$ Control of GaN Transistors","authors":"Plinio Bau, M. Cousineau, B. Cougo, F. Richardeau, S. Vinnac, D. Flumian, N. Rouger","doi":"10.1109/ISPSD.2019.8757693","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757693","url":null,"abstract":"This paper presents an AGD (active gate driver) implemented with a low voltage CMOS technology to control the $mathbf{d}boldsymbol{v}/mathbf{d}boldsymbol{t}$ sequence of low voltage (100V) and high voltage (650V) GaN power transistors. Such an AGD can control and reduce the $mathbf{d}boldsymbol{v}/mathbf{d}boldsymbol{t}$ of fast switching GaN devices with a reduced impact on switching losses. In the case of both low voltage and high voltage GaN fast switching transistors, such an AGD must have a total response time lower than 1ns. Therefore, introducing a feedback loop to control the $mathbf{d}boldsymbol{v}/mathbf{d}boldsymbol{t}$ requires a specific design with a very high bandwidth (550MHz). Moreover, probing the $boldsymbol{v}_{mathbf{DS}}$ voltage and its derivative is quite challenging, as the voltage level is higher than the low voltage gate driver supply. The purpose of this work is to optimize a low voltage CMOS AGD with fully integrated functions, and implement such a solution in GaN-based power converters.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"2021 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120920533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mutual inductance influence to switching speed and TDR measurements for separating self- and mutual inductances in the package 在封装中分离自感和互感时,互感对开关速度和TDR测量的影响
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757658
H. Iida, K. Hasegawa, I. Omura
{"title":"Mutual inductance influence to switching speed and TDR measurements for separating self- and mutual inductances in the package","authors":"H. Iida, K. Hasegawa, I. Omura","doi":"10.1109/ISPSD.2019.8757658","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757658","url":null,"abstract":"Parasitic inductances in power semiconductor packages affect the device switching speeds. The self-inductance of the source terminal has been considered to be the main factor that limits the switching speed, but mutual inductances among the three terminals also influence the speed. This paper proposes a method to measure the source self-inductance and the mutual inductances in the package using time-domain reflectometry (TDR) and time-domain transmissometry (TDT) that reveals the limitation of the switching speed. The measurement results agreed well with those of Q3D simulation.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132594894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A New 200 V Dual Trench MOSFET With Stepped Oxide for Ultra Low RDS(on) 一种用于超低RDS的新型阶梯氧化200 V双沟槽MOSFET (on)
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757572
Chanho Park, M. Azam, Gabriel Dengel, A. Shibib, K. Terrill
{"title":"A New 200 V Dual Trench MOSFET With Stepped Oxide for Ultra Low RDS(on)","authors":"Chanho Park, M. Azam, Gabriel Dengel, A. Shibib, K. Terrill","doi":"10.1109/ISPSD.2019.8757572","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757572","url":null,"abstract":"A new 200 V rating power trench MOSFET having dual trench structures with stepped oxide in the drift region, used here for the first time has been proposed and implemented to obtain higher breakdown voltages with lower drain-source on-state resistance, RDS(on). A more efficient reverse blocking voltage capability to reduce the drift region resistance by increasing doping concentration of the drift region has been demonstrated by this approach. We obtained $mathbf{Rsp} =215mathbf{m}mathbf{Omega}cdot mathbf{mm}^{2}$ at the breakdown voltage of 225 V from the first fabricated devices, and $mathbf{Rsp} =196 mathbf{m}mathbf{Omega}cdot mathbf{mm}^{2}$ at 224 V from the simulated devices, which positions them as the best-in-class on-state drain-source specific resistance, Rsp, with comparable voltage rating devices.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"358 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131650135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Revealing the Positive Bias Temperature Instability in Normally-OFF AlGaN/GaN MIS-HFETs by Constant-Capacitance DLTS 用恒电容DLTS揭示常关AlGaN/GaN mishfet的正偏置温度不稳定性
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757587
Sen Huang, Xinhua Wang, Xinyu Liu, X. Kang, Jie Fan, Shu Yang, H. Yin, K. Wei, Yingkui Zheng, Xiaolei Wang, Wenwu Wang, Jingyuan Shi, Hongwei Gao, Qian Sun, K. J. Chen
{"title":"Revealing the Positive Bias Temperature Instability in Normally-OFF AlGaN/GaN MIS-HFETs by Constant-Capacitance DLTS","authors":"Sen Huang, Xinhua Wang, Xinyu Liu, X. Kang, Jie Fan, Shu Yang, H. Yin, K. Wei, Yingkui Zheng, Xiaolei Wang, Wenwu Wang, Jingyuan Shi, Hongwei Gao, Qian Sun, K. J. Chen","doi":"10.1109/ISPSD.2019.8757587","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757587","url":null,"abstract":"Effects of oxide/III-nitride interface and oxide states on the threshold voltage instability ($boldsymbol{V}_{mathbf{TH}}$-Instability) of normally-OFF Al2O3/AlGaN/GaN MIS-HFETs, i.e., metal-insulator-semiconductor heterojunction field-effect transistors, were revealed by constant-capacitance deep level transient spectroscopy (CC-DLTS). It is confirmed that a technique of in-situ remote plasma pretreatments could effectively suppress the $boldsymbol{D}_{mathbf{it}}$ with level depth ($boldsymbol{E}_{mathbf{C}}-boldsymbol{E}_{mathbf{T}}$) larger than 0.4 eV down to below $1.3times 10^{12} mathbf{cm}^{-2}mathbf{eV}^{-1}$, in spite of the presence of a discrete level with $boldsymbol{E}_{mathbf{C}}-boldsymbol{E}_{mathbf{T}}$ and capture cross section ($boldsymbol{sigma}_{mathbf{n}}$) being 0.33 eV and $4.0times 10^{-15} mathbf{cm}^{2}$ respectively. However, electron charging of oxide states occurs when the MIS-HFETs are pulsed by a high positive gate bias (e.g., > 8 V), as confirmed by a reduced tunnel constant $boldsymbol{d}_{0}$ of 0.79 nm. High electric field induced tunnel filling of gate oxide states could be an assignable cause for the positive bias temperature instability in normally-OFF III-nitride MIS-HFETs.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133336462","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module 一种新型一体化数模异构集成智能电源模块
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757581
Y. Lin, K. Kao, C. Tzeng, H. Lin, W. Han, J.Y. Chang, T. Chang
{"title":"A Novel All-in-One Digital-Analog Heterogeneous Integrated Intelligent Power Module","authors":"Y. Lin, K. Kao, C. Tzeng, H. Lin, W. Han, J.Y. Chang, T. Chang","doi":"10.1109/ISPSD.2019.8757581","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757581","url":null,"abstract":"This paper introduces a novel all-in-one digital-analog heterogeneous integrated intelligent power module (IPM) which is composed of Si MOSFETs, Gate Driver and Micro Controller Unit (MCU). This novel all-in-one module realized by heterogeneous integration offers a System in Package (SiP) solution without causing serious Electromagnetic Compatibility (EMC), signal integrity and thermal issues. In addition, we designed the three-phase half-bridge inverter system formed by this IPM to compare with the system consisting of the same circuit and same bare dies of MOSFETs (TO-package), Gate Driver and MCU (SO-package). The performance shows that the inverter system which adopted this intelligent power module is capable of reducing system energy consumption, enhancing system efficiency (2-4%), and successfully shrinking system volume(>33%) at the same time. Besides, this SiP IPM can improve system reliability, electromagnetic compatibility (EMC) performance and pass the international standard of CISPR 11. Keywords-SiP, heterogeneous integration, IPM, EMC, power density.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133412612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analog Basis, Low-Cost Inverter Output Current Sensing with Tiny PCB Coil Implemented inside IPM 模拟基础,低成本逆变器输出电流传感与微型PCB线圈在IPM内实现
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757580
Battuvshin Bayarkhuu, Bat-Otgon Bat-Ochir, K. Hasegawa, M. Tsukuda, B. Dugarjav, I. Omura
{"title":"Analog Basis, Low-Cost Inverter Output Current Sensing with Tiny PCB Coil Implemented inside IPM","authors":"Battuvshin Bayarkhuu, Bat-Otgon Bat-Ochir, K. Hasegawa, M. Tsukuda, B. Dugarjav, I. Omura","doi":"10.1109/ISPSD.2019.8757580","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757580","url":null,"abstract":"This paper proposes a practical current sensor integration in the intelligent power modules (IPMs) using simple PCB Rogowski coil sensors. The PCB sensors produce signals that proportional to the high frequency switching current from high and low side IGBTs. Then with only general-purpose Op-Amps and photo-couplers based integrator and sample and hold (S/H) circuits reproduce output current of the inverter. Specifically, the “envelop tracking” method has successfully proved on an experimental inverter setup. A significant accomplishment of an improved new analog circuit is the measurement during narrow pulse width around unity modulation index that leads to higher inverter output power.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133036204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Investigation of UIS Capability for −600V Class Vertical SiC p-channel MOSFET −600V级垂直SiC p沟道MOSFET的UIS性能研究
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757607
Kailun Yao, H. Yano, N. Iwamuro
{"title":"Investigation of UIS Capability for −600V Class Vertical SiC p-channel MOSFET","authors":"Kailun Yao, H. Yano, N. Iwamuro","doi":"10.1109/ISPSD.2019.8757607","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757607","url":null,"abstract":"Vertical planar gate 4H-SiC p-ch SiC MOSFET is fabricated as a potential candidate for complementary power applications. Its unclamped inductive switching (UIS) capability is investigated by measurement and TCAD simulation. The p-ch SiC MOSFET shows a low UIS capability rather than n-ch SiC MOSFET because of the unoptimized termination structure. The UIS capability of p-ch MOSFET can be improved by good design of edge region.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123721705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A Laterally Monolithic-Integrated Multi-Cascode for Applications with 600V and more based on 20V-FINFETs in 90nm Technology 基于90nm技术的20v finfet的600V及以上应用的横向单片集成多级联码
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757604
Rolf Wei, M. Lemke, M. Müller, R. Rudolf, K. Stahrenberg, T. Bertrams, M. Bartels, A. Mahmoud, N. Nagel
{"title":"A Laterally Monolithic-Integrated Multi-Cascode for Applications with 600V and more based on 20V-FINFETs in 90nm Technology","authors":"Rolf Wei, M. Lemke, M. Müller, R. Rudolf, K. Stahrenberg, T. Bertrams, M. Bartels, A. Mahmoud, N. Nagel","doi":"10.1109/ISPSD.2019.8757604","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757604","url":null,"abstract":"Over decades the usage of the charge compensation principle for power devices has improved the performance and efficiency of typical applications in almost all voltage classes like power supplies, converters and drives. Different types of charge compensation concepts were applied to various device structures like the superjunction compensation, the field plate compensation and the dynamic compensation in form of bipolar electron-hole plasma. For each voltage class, unique technologies have been developed to adjust and optimize drift zone length, doping concentrations and avalanche robustness, leading to a large variety of different vertical and lateral power device technologies. In this paper, laterally monolithic-integrated multi-transistor cascodes are presented as highvoltage MOSFET transistors for a large range of breakdown voltages from 20V to multiple hundred volts.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123258001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Static and Dynamic Figures of Merits (FOM) for Superjunction MOSFETs 超结mosfet的静态和动态优劣图
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757689
H. Kang, F. Udrea
{"title":"Static and Dynamic Figures of Merits (FOM) for Superjunction MOSFETs","authors":"H. Kang, F. Udrea","doi":"10.1109/ISPSD.2019.8757689","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757689","url":null,"abstract":"The introduction of the superjunction has challenged the well-known limit of silicon. In spite of its widespread use, and despite its correct application in classical power MOSFETs, Baliga's figure of merit no longer can be used to give an accurate picture of the material potential in power electronics. Fujihira has updated both the static and dynamic figures of merit, but, as the cell pitch of the SJ scale down, these figure of merits need to include the parasitic JFET effect and an analytical formulation of the gate-drain capacitance and its intricate dependence on the drain voltage. This work presents for the first-time new static and dynamic figure of merits which take into account the spectacular advances in the SJ technology, where the cell dimensions are approaching the sub-micrometer level.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116447772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Short-Circuit Robustness of 4600 V SiC DMOSFETs 4600 V SiC dmosfet的短路稳健性
2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) Pub Date : 2019-05-01 DOI: 10.1109/ISPSD.2019.8757686
S. Sundaresan, Stoyan Jeliazkov, V. Mulpuri, R. Singh, Sumit Jadav
{"title":"Short-Circuit Robustness of 4600 V SiC DMOSFETs","authors":"S. Sundaresan, Stoyan Jeliazkov, V. Mulpuri, R. Singh, Sumit Jadav","doi":"10.1109/ISPSD.2019.8757686","DOIUrl":"https://doi.org/10.1109/ISPSD.2019.8757686","url":null,"abstract":"A comprehensive investigation of the operating limits and failure modes for 4600 V/7.78 mm2 SiC DMOSFETs under short-circuit conditions is performed. Depending on device design and driving conditions, short-circuit withstand times (tSC) in the range of $3-14 boldsymbol{mu}mathbf{s}$ are recorded on the DMOSFETs. The impact of various factors such as the device design, gate drive voltage, DC link (drain) voltage, and operating temperature on the tSC is quantified. The evolution of the I-V and C-V characteristics under short-circuit operation is examined, and failure mechanisms are suggested.","PeriodicalId":225029,"journal":{"name":"2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121946276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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