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2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)最新文献

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Imaging of NW placement for 10 nm and beyond 成像NW放置10纳米及以上
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7966559
Gregory M. Johnson, J. Nxumalo, Chrisophter Mollela, Christopher D'Aleo, Andrew Dalton
{"title":"Imaging of NW placement for 10 nm and beyond","authors":"Gregory M. Johnson, J. Nxumalo, Chrisophter Mollela, Christopher D'Aleo, Andrew Dalton","doi":"10.23919/MIPRO.2017.7966559","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966559","url":null,"abstract":"Understanding of the accuracy of well (here, N-well or NW) placement is a key feature for device characterization and understanding of yield detractors. An analysis technique which provides quick turnaround and allows not only quick examination across large areas but also SEM resolution is needed. Failure analysis of an RX (active) Short in a < 14 nm serpentine/comb test structure indicated a junction problem. A novel yet simple technique for mapping junction profiles based on contrasts observed in low energy e-beam SEM voltage contrast (SEM-VC) was evaluated on carefully delayered samples. The test samples were also characterized by scanning capacitance microscopy (SCM) to correlate with SEM-VC results. The SEM-VC in one case exactly predicted the well image. However, further investigation showed that distinct SEM-VC features on other similarly delayered samples had nothing to do with the underlying junction profiles. For this reason, OBIRCH (Optical Beam Induced Resistance CHange) was used to determine areas of high and low leakage for an SRAM-like test structure.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"60 23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129636472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
In-line control of material properties of SiOC:H based low-k dielectrics utilizing optical metrology 利用光学计量在线控制基于 SiOC:H 的低介电材料特性
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7966539
A. Urbanowicz, Peter Ebersbach, D. Likhachev, D. Mezerette, C. Hartig
{"title":"In-line control of material properties of SiOC:H based low-k dielectrics utilizing optical metrology","authors":"A. Urbanowicz, Peter Ebersbach, D. Likhachev, D. Mezerette, C. Hartig","doi":"10.23919/MIPRO.2017.7966539","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966539","url":null,"abstract":"Manufacturing process control of porous SiOC:H low-k dielectrics is challenging due to their hybrid nature and process damage vulnerability. We discuss advanced optical modeling of various low-k dielectrics that allows one to reflect their material properties and improves accuracy and precision of scatterometry models widely utilized in manufacturing process control. Furthermore, we explore usage of optical material model data for investigating UV-curing and deposition chamber signatures as well as variety of process damage that requires strict control.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"22 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127262839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Laser grooving profile optimization for chip strength enhancement 提高切屑强度的激光开槽轮廓优化
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7966564
P. Tsai, J. chen, R. Wang, C.S. Liu, Harry Ku
{"title":"Laser grooving profile optimization for chip strength enhancement","authors":"P. Tsai, J. chen, R. Wang, C.S. Liu, Harry Ku","doi":"10.23919/MIPRO.2017.7966564","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966564","url":null,"abstract":"Laser grooving process is crucial to thin chip strength. Much of paper has been put on the mechanism of laser grooving, but only few investigations were taken for chip strength enhancement. In this paper, thin chip (less than 100um chip thickness) is adopted, and the experiment of laser grooving process is carried out for mechanical characteristics evaluation. Based on experiment results, the optimal process condition has been determined. A notable improvement for thin chip strength is achieved after process optimization.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132259774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Raman spectroscopy analysis utilized to identify stress induced leakage from power and high speed technologies using deep trench isolation schemes 拉曼光谱分析用于识别应力引起的泄漏电力和高速技术使用深沟隔离方案
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7966537
C. Parker, T. Budri
{"title":"Raman spectroscopy analysis utilized to identify stress induced leakage from power and high speed technologies using deep trench isolation schemes","authors":"C. Parker, T. Budri","doi":"10.23919/MIPRO.2017.7966537","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966537","url":null,"abstract":"Power and Advanced BiCMOS technologies use deep trench architecture to reduce capacitance and leakages that are enhanced by high electric fields and high current applications. In this paper, a power and an advanced BiCMOS technology with deep trench architectures used micro Raman spectroscopy to identify non-uniform stress regions in the circuit. Using this information, architectural changes were implemented to reduce the overall stress and subsequent leakage. In both cases, multiprobe yields were increased due to the reduced circuit leakage.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128780736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparison of game engines for serious games 严肃游戏的游戏引擎比较
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973518
Sanja Pavkov, Ivona Frankovic, N. Hoić-Božić
{"title":"Comparison of game engines for serious games","authors":"Sanja Pavkov, Ivona Frankovic, N. Hoić-Božić","doi":"10.23919/MIPRO.2017.7973518","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973518","url":null,"abstract":"Serious educational games are specially designed computer games which are used in an educational setting, in other words, they are interactive competitive lessons with defined learning outcomes which allow students to have fun during learning. The importance of serious games in contemporary educational practice is increasing. Applying serious games in teaching, students facilitate the learning process, adopt new skills and abilities, show more interest in learning, are more focused and more active in a class, and better understand and apply lessons learned. The complexity of serious games requires large efforts for their development. For the development of serious games teachers mostly use commercial game engines. One of the important parts of game development is a selection of appropriate development tool. Due to the range of available tools the choice of platforms for serious games is a challenge, whose selection often has considerably different goals and technical requirements depending on context and usage. The aim of this paper is to propose criteria which should be considered before selecting a game engine for serious games and shows results of a comparison of evaluated most popular game engines. Some recommendations for teachers about choosing the most suitable game engines for serious games development are also presented.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126885369","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
The role of applications and their vendors in evolution of software ecosystems 应用程序及其供应商在软件生态系统演变中的作用
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973648
S. Hyrynsalmi, Petri Linna
{"title":"The role of applications and their vendors in evolution of software ecosystems","authors":"S. Hyrynsalmi, Petri Linna","doi":"10.23919/MIPRO.2017.7973648","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973648","url":null,"abstract":"The most recent trends in the electronic commerce research have suggested that forming an ecosystem around a platform would create a winning solution. The ecosystem, consisting of vendors and external actors, would create competitive advantage for the platform owner. Furthermore, the sheer number of the actors has been used as the measure of the ecosystem's well-being against competing ecosystems. Whereas a number of studies has been devoted to analyse the well-being indicators or structures of software ecosystems and the importance of complementors and complements are acknowledged, there is lack of studies addressing how the complementors affect into the evolution of ecosystems. This conceptual analysis aims to open discussion on this topic by using the mobile application ecosystems—such as Google Play or Apple's iOS—as the case subject. While the results suggest some implications for the platform owners and complementors, more work is needed","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121309215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Distributed threat removal in software-defined networks 软件定义网络中的分布式威胁移除
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973469
Dominik Samociuk, A. Chydzinski
{"title":"Distributed threat removal in software-defined networks","authors":"Dominik Samociuk, A. Chydzinski","doi":"10.23919/MIPRO.2017.7973469","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973469","url":null,"abstract":"We propose an architecture for distributed threat removal in software-defined networks. This is a novel design of a large network, in which security analysis must be performed. In the classic paradigm, the security analyzer is an entry device, connected serially with the rest of the topology. Obviously, this device may suffer from a high processing load. Therefore, it may create a bottleneck, when the arriving traffic is waiting for the security verification, before being forwarded to next devices in the network. In the proposed architecture, traffic is immediately forwarded towards all destinations, while the security analysis is carried out in parallel, resulting in offloading the entry security device. We show that the proposed solution reduces the bottleneck in the topology and increases the rate of the carried traffic, while ensuring the same, as in the classic approach, security level.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"11 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120888417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine learning techniques in the education process of students of economics 经济学学生教育过程中的机器学习技术
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973522
J. Bucko, L. Kakalejcík
{"title":"Machine learning techniques in the education process of students of economics","authors":"J. Bucko, L. Kakalejcík","doi":"10.23919/MIPRO.2017.7973522","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973522","url":null,"abstract":"Nowadays, in the period of the digitalization and knowledge economy development, majority of activities result in the increase of data that should be captured. In each area of business, there is an increasing urge to extract the knowledge from data in a timely manner in order to be able to make shifts that ensure a competitive advantage. Thus, the knowledge of methods and techniques of big data processing is currently a tool of a modern economist. Courses oriented to how to use machine learning tools in the economic practice should become a part of a study plan at universities of economics and business. In our paper, we propose the concept of teaching of machine learning techniques using software Weka as a possible solution to integrate this issue into the study plan based on the example of problem-based learning.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121205665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Terahertz multispectral imaging of epitaxially grown semiconductors' lattice defects 外延生长半导体晶格缺陷的太赫兹多光谱成像
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7966543
A. Rahman
{"title":"Terahertz multispectral imaging of epitaxially grown semiconductors' lattice defects","authors":"A. Rahman","doi":"10.23919/MIPRO.2017.7966543","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966543","url":null,"abstract":"Epitaxially grown SiGe and Ge layers on Si <100> substrate have been analyzed by terahertz multispectral reconstructive 3D imaging technique. In particular, 3D images of both samples were generated via a non-contact and non-destructive route and were analyzed by utilizing the terahertz reconstructive imaging algorithm. It was found that the algorithm of “gridding with inverse distance to power equations” adopted herein for reconstructive imaging is capable of reproducing the results accurately as indicated by a good match with the TEM images of the same samples. Both the 3D and 2D images were analyzed by graphical means to determine the respective layers' thicknesses. The results were compared with the TEM images. Both the terahertz and TEM results were found to be in good agreement. Further, the imaging technique was also able to detect and quantify the size of small features of <1 nm present in the SiGe epi layer. In addition, lattice stacking fault and dislocations were also visualized and identified.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124990782","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Synergy of ITIL methodology and help users systems ITIL方法和帮助用户系统的协同作用
2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) Pub Date : 2017-05-01 DOI: 10.23919/MIPRO.2017.7973483
Ivan Ivosic
{"title":"Synergy of ITIL methodology and help users systems","authors":"Ivan Ivosic","doi":"10.23919/MIPRO.2017.7973483","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973483","url":null,"abstract":"Information and communication technology, services and corporate security shape modern working places creating new added values. The development of technology markets and new innovations impose phrase how to lead IT and thereby be successful. The article describes and develops pragmatism and interdisciplinary of information systems of companies with the help of ITIL methodology. The construction of the help users system can improve business, but it is not easy to provide safety and legal economic regulator. Social and political system defines a new user and its function and role and the challenge is to balance customer needs and IT engineering support in a globalized world where is the thin dividing line between work and private.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121590005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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