Laser grooving profile optimization for chip strength enhancement

Abstract

Laser grooving process is crucial to thin chip strength. Much of paper has been put on the mechanism of laser grooving, but only few investigations were taken for chip strength enhancement. In this paper, thin chip (less than 100um chip thickness) is adopted, and the experiment of laser grooving process is carried out for mechanical characteristics evaluation. Based on experiment results, the optimal process condition has been determined. A notable improvement for thin chip strength is achieved after process optimization.