2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)最新文献

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Introducing gamification into e-learning university courses 将游戏化引入电子学习大学课程
A. Bernik, D. Radošević, G. Bubas
{"title":"Introducing gamification into e-learning university courses","authors":"A. Bernik, D. Radošević, G. Bubas","doi":"10.23919/MIPRO.2017.7973515","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973515","url":null,"abstract":"Research on educational e-courses that contain only a series of motivating elements of computer games but do not include playing computer games has intensified since 2010 [1] [6]. This field of research is called gamification and represents the use of game elements (mechanics, dynamics and aesthetics) in a field (education, marketing etc.) that is not a computer game. A review of literature related to the field of teaching with online courses in information technology (e.g. programming, software engineering) shows that the topic of gamification has so far been inadequately explored, with the lack of theoretical and empirical research that would involve gamification methodology. Previous studies have shown that gamification can have a positive impact on the pedagogical and psychological aspects of e-learning. In this paper empirical research is presented regarding the use of gamification in online teaching of programming. A gamified e-course was designed for the lectures in programming, and a possible positive effect was examined on the usage of learning materials in an experimental group of students who will use a gamified e-course (online system).","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128872798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
A batch study of trace metal impurities in high-k semiconductor precursors 高k半导体前驱体中痕量金属杂质的批量研究
Vijay Chowdhury, M. Islam, Shi Liu
{"title":"A batch study of trace metal impurities in high-k semiconductor precursors","authors":"Vijay Chowdhury, M. Islam, Shi Liu","doi":"10.23919/MIPRO.2017.7966548","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966548","url":null,"abstract":"Advanced electronic materials called precursor molecules are designed for the deposition of thin films that are expected to be reliable, contamination free and pristine. Deleterious effects of metallic contamination have been demonstrated in dielectric properties of thermal oxides grown on silicon [1]. In order to achieve ultra-high purity products, essentially free from trace metals (TM) and organic impurities, they need to be fully qualified. Upfront, TM analysis allows detection, identification and quantification of these contaminants to help control the quality of these precursors thus making them the preferred candidates for atomic layer deposition of high-k materials as storage capacitors in DRAM applications, or gate stacks of MOS-transistors. In this paper, we will demonstrate the inherent variability of trace metal concentrations in precursors, that necessitates the quantification for evaluation, qualification and periodic monitoring of suppliers. We will reveal the presence of high levels of TM contaminants that are present in varying amounts from batch to batch and supplier to supplier for the same precursor. Additionally, the same precursor from two different suppliers may contain totally different TM contaminants.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"11 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131289364","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Integrating evolving MDM and EDW systems by data vault based system catalog 通过基于系统目录的数据库集成不断发展的MDM和EDW系统
Danijela Jakšić, V. Jovanovic, P. Poščić
{"title":"Integrating evolving MDM and EDW systems by data vault based system catalog","authors":"Danijela Jakšić, V. Jovanovic, P. Poščić","doi":"10.23919/MIPRO.2017.7973641","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973641","url":null,"abstract":"The paper presents results of a research on integration of enterprise data warehouse (EDW) and a master data management (MDM) system. The primary goal was solving a schema evolution problem, and the corner stone of our approach was utilization of a data vault modeling of an integrated meta-model of EDW and MDM as an expansion of a traditional relational database system catalog. The main contributions of this paper are: a) common integration architecture, b) new system catalog based on a meta-model for DW and MDM integration, and c) research prototype used for empirical validation of the effectiveness of the proposed solution.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131323059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Programming Lego Mindstorms for First Lego League Robot game and technical interview 为第一款Lego League Robot游戏编程Lego Mindstorms和技术面试
B. Strnad
{"title":"Programming Lego Mindstorms for First Lego League Robot game and technical interview","authors":"B. Strnad","doi":"10.23919/MIPRO.2017.7973562","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973562","url":null,"abstract":"It is of great importance in the information age to equip children with the capacity to independently navigate in the flood of all available data and be responsible towards acquiring knowledge. We must provide a learning environment, where children can be enhanced to think creatively and develop innovative solutions. The article further presents the robotic part (a robot game with a technical interview) that is half of the multidisciplinary program First® Lego® League, which was brought to Slovenia by Super Glavce, the Institute for the Promotion of Knowledge. There is an overview of several months' work and the preparation for the robotic part of the competition, where children have to build and programme an autonomous robot that can complete as many tasks on the competition mat as possible in a limited amount of time. During this process a technical portfolio is made, where children record the progress, the problems and describe ways of solving the problem, explain strategies and present innovative solutions. The technical portfolio is the basis for the technical interview. The ways of working with lego robots in preparation for the First® Lego® League competition can be successfully replicated in class with the topic of algorithmic ways of thinking and programming.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"451 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131402716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Remarks on visualization of fuzziness of cardiac data 心脏数据的模糊性可视化刍议
Janusz Opila, T. Pelech-Pilichowski
{"title":"Remarks on visualization of fuzziness of cardiac data","authors":"Janusz Opila, T. Pelech-Pilichowski","doi":"10.23919/MIPRO.2017.7973435","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973435","url":null,"abstract":"In contemporary health science sophisticated apparatus delivers a lot of data on vital processes in patients. All of them are processed as a bulk of numbers not suitable directly for diagnosing or research purposes. Moreover, which is common in biomedical sciences, measured data are intrinsically inaccurate, i.e., fuzzy. In order to overcome these deficiencies a set of visualization methods has been developed as well as dedicated file formats. In the paper authors discuss selected formats and imaging techniques useful for cardiologists. Problems of medical data processing is outlined. Strengthens and weaknesses of raw STL file format are analyzed. Visualization styles of data fuzziness using experimental package ScPovPlot3D based on POVRay are proposed and discussed.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"482 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115630703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inverter current source for pulse-arc welding with improved parameters 改进参数的脉冲弧焊逆变电流源
V. Valchev, D. D. Mareva, D. Yudov, R. Stoyanov
{"title":"Inverter current source for pulse-arc welding with improved parameters","authors":"V. Valchev, D. D. Mareva, D. Yudov, R. Stoyanov","doi":"10.23919/MIPRO.2017.7973404","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973404","url":null,"abstract":"The feature of power current sources for pulse-arc welding is superimposing of current pulses with a defined shape, size and frequency on the main welding current. The purpose of this paper is to explore the possibilities to control the parameters of superimposed pulses by a particular (additional) welding inverter current source with improved parameters. The current pulse superimposed to the basic current has duration of 1.5 ÷ 3.0 µs and is realized by an additional source. The operation and the characteristics of the scheme are investigated by simulations (PSpice) under various modes and loads. The formation and separation of the drop from the end of the electrode is controlled by the amplitude and duration of the pulse current. Thus, the average welding current can be significantly reduced. Dependences of the parameters of pulses on specific components of scheme are derived. Recommendations are made to improve the performance and utilization of the circuit elements and the technological process. Design recommendations are presented to optimize the parameters of the transformer.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"32 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115671564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Embedded spectroscopic reflectometry metrology on FEOL silicon dioxide trench polishing equipment FEOL二氧化硅沟槽抛光设备的嵌入式光谱反射计量
S. Bourzgui, A. Roussy, J. Blue, G. Georges, E. Faivre, K. Labory, J. Pinaton
{"title":"Embedded spectroscopic reflectometry metrology on FEOL silicon dioxide trench polishing equipment","authors":"S. Bourzgui, A. Roussy, J. Blue, G. Georges, E. Faivre, K. Labory, J. Pinaton","doi":"10.23919/MIPRO.2017.7966614","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966614","url":null,"abstract":"The aim of the research is to develop a material thickness measurement method to monitor oxide polishing by Chemical-Mechanical Planarization (CMP) during the realization of the Shallow Trench Isolation (STI). The underlying goal is to build a statistical regulation model of the polishing time on a single platen (the two others platens are monitored by an endpoint signal). In addition to the process parameters (head sweep, platen, and head rotation velocity), input and output polished material thicknesses data are essential to build a run-to-run model for CMP. Therefore, stack layer thickness, before and after polishing, needs to be measured fast enough to maintain the acceptable throughput and to accurately control the polishing time wafer by wafer. In this paper, we describe how spectroscopic reflectometry embedded in the polishing equipment, can meet rapidity and capability requirements in setting up a run-to-run control algorithm to maintain the target thickness for STI CMP.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"281 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123987348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of chronic venous insufficiency with PPG prototype instrument PPG原型仪对慢性静脉功能不全的评价
Matej Makovec, U. Aljancic, D. Vrtacnik
{"title":"Evaluation of chronic venous insufficiency with PPG prototype instrument","authors":"Matej Makovec, U. Aljancic, D. Vrtacnik","doi":"10.23919/MIPRO.2017.7973445","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973445","url":null,"abstract":"Photoplethysmography (PPG) is a non-invasive optical technique for measurement of blood volume changes inside an organ or body part. In presented study, a chronic venous insufficiency (CVI) of 25 individuals (38 legs) was measured using PPG prototype instruments. The results of PPG evaluation were compared to results of Doppler ultrasound, which is the gold standard for diagnosis of CVI. The sensitivity and specificity of PPG prototype instrument in amount of 82% and 81%, respectively was calculated.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117245207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Characterization of measurement system for high-precision oscillator measurements 高精度振荡器测量系统的特性
Ivan Brezovec, Marko Magerl, Josip Mikulić, G. Schatzberger, A. Barić
{"title":"Characterization of measurement system for high-precision oscillator measurements","authors":"Ivan Brezovec, Marko Magerl, Josip Mikulić, G. Schatzberger, A. Barić","doi":"10.23919/MIPRO.2017.7973396","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7973396","url":null,"abstract":"Temperature stability of a high-precision oscillator is characterized by measurements in a temperature chamber. Two time constants are measured for a given temperature of the chamber: (i) time required for the silicon to reach the steady-state temperature obtained by measuring the time-domain voltage response of the on-chip temperature sensor; (ii) time required for the oscillator circuit to reach the steady-state frequency obtained by measuring the oscillator frequency in the time-domain. The temperature probe for measuring the chamber temperature is characterized in terms of its response to a step in temperature. The noise performance of the measurement system is characterized based on Allan deviation.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128475861","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High growth rate atmospheric Epi solution delivers high productivity 高生长速率常压Epi溶液提供高生产率
R. Bashyam, C. Caballero, Y. Mori, Benjamin Lee
{"title":"High growth rate atmospheric Epi solution delivers high productivity","authors":"R. Bashyam, C. Caballero, Y. Mori, Benjamin Lee","doi":"10.23919/MIPRO.2017.7966608","DOIUrl":"https://doi.org/10.23919/MIPRO.2017.7966608","url":null,"abstract":"With the strong growth of power devices into 2020 and beyond (5.3% CAGR from 2016–2021[1]), average Si Epitaxial (epi) thickness has been increasing to support 400– 1000V devices, the largest market segment in power. The current epi chamber offerings are primarily used for thin epi (<20µm), in some cases for thicknesses up to 60µm, where batch reactors are mostly used because of throughput, cost, and the ability to grow thick epi films without wafer bridging (sticking). However, increasingly stringent requirements for on-wafer performance are exceeding batch reactor performance. Applied Materials has developed a new epi chamber on the Centura platform, which addresses all the challenges of growing thicker films (>40µm) in a single wafer reactor. The new high growth rate (HGR) Atmospheric (ATM) epi chamber enables significantly lower cost of ownership (CoO), while maintaining the same or better on-wafer performance. Growth rate increased up to 6 µm/min, dome coating is significantly reduced, wafer sliding and sticking are eliminated. In addition, the HGR ATM Epi chamber performance enables thin and thick epi growth in the same chamber, eliminating the need to have dedicated chambers for different thicknesses.","PeriodicalId":203046,"journal":{"name":"2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128739297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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