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Photopatternable silicone compositions for electronics packaging applications 用于电子封装应用的可光制版有机硅组合物
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 2004-05-14 DOI: 10.1117/12.533804
F. Shih, B. Harkness, G. Gardner, J. S. Alger, M. Cummings, J. L. Princing, H. Meynen, H. Nguyen, W. Flack
{"title":"Photopatternable silicone compositions for electronics packaging applications","authors":"F. Shih, B. Harkness, G. Gardner, J. S. Alger, M. Cummings, J. L. Princing, H. Meynen, H. Nguyen, W. Flack","doi":"10.1117/12.533804","DOIUrl":"https://doi.org/10.1117/12.533804","url":null,"abstract":"Development of the next generation of electronics devices is creating a need for new specialized materials, application and integration processes for building reliable yet sophisticated packaging architectures. Key physical property attributes of these new materials include flexibility, low stress, and high thermal stability. To meet these needs Dow Corning is developing a family of spin coatable photopatternable silicone materials, application processes, as well as integration know-how to assist device manufactures in building the next generation of devices enabled by silicone based material technologies. These new materials can be easily coated onto electronics substrates and have been patterned using a commercially available stepper from Ultratech Inc. Films with a thickness ranging from 6 to 50 /spl mu/m have been demonstrated with patterned features resolved to 20 /spl mu/m dimensions in 20 /spl mu/m thick films. The etched regions provide a shallow sidewall slope and smooth curved surfaces that facilitate direct on silicone metallisation. After patterning the films can be cured at low temperatures (150 to 250/spl deg/C) to provide modulus values in the range of 150 to 500 MPa. These materials are inherently hydrophobic and are based on a cure System that is acid free and delivers highly thermally stable crosslinks without the need to outgas photocatalysts or ancillary chemicals. As a result, the films show very little shrinkage during thermal cure (/spl sim/2%), do not require extended high temperature processing, and provide a very low stress (<5 MPa). Yet in spite of their low temperature cure capability these materials show excellent thermal stability and mechanical integrity when exposed to high temperatures.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128182612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 16
3M tribo-coating development and its application on microinterconnect flexible circuit 3M摩擦涂层的研制及其在微互连柔性电路中的应用
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298734
Ke Zhang, Juang Meng Mok, H. Choong Meng, Y. Lee
{"title":"3M tribo-coating development and its application on microinterconnect flexible circuit","authors":"Ke Zhang, Juang Meng Mok, H. Choong Meng, Y. Lee","doi":"10.1109/EPTC.2003.1298734","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298734","url":null,"abstract":"To develop a conductive polymer formulation which can be printed using an automated reel-to-reel process to form a thin film (0.1 to 25 /spl mu/m) on insulating materials. The materials can be but are not limited to, polymers, engineering plastic, ceramics, glasses, fibers, hard coating layers, especially on microinterconnect flexible circuits (1 to 10 mil in total thickness with or without organic cover, coating materials) Made from polyimide or Liquid crystal polymers (LCP) substrates. A thin conductive film will significantly reduce surface resistivity of the coated surfaces to a range of 10E5 to 10E9 ohms. The thickness of the film can be adjusted by the cliche design for pad printing with a dimensional alignment control of +/10-20%, or by the mesh design for screen-printing when there is a need in covering small features (200/spl mu/m). The printing process is a reel-to-reel high volume-manufacturing line.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114680079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dancing with bumping 与碰撞共舞
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298709
Fei-jain Wu
{"title":"Dancing with bumping","authors":"Fei-jain Wu","doi":"10.1109/EPTC.2003.1298709","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298709","url":null,"abstract":"","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127168719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The design and optimization of a package for frequency divider at 5.5 GHz 5.5 GHz分频器封装的设计与优化
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298701
Huang Jinsheng, Zheng Hongyu, Gao Shang-tong
{"title":"The design and optimization of a package for frequency divider at 5.5 GHz","authors":"Huang Jinsheng, Zheng Hongyu, Gao Shang-tong","doi":"10.1109/EPTC.2003.1298701","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298701","url":null,"abstract":"High speed IC-packages require high electric performance, high I/O number, high interconnect density, low thermal resistance, especially high electromagnetic performance. The parasitics associated with integrated circuit packaging are beginning to affect the performance of the integrated circuit with the rise in operating frequencies. Hence it has become necessary to model various characteristics of the package to provide better understanding of these effects. The package design and analysis should be aided with computer and some CAD/CAA software. This paper introduces the design and optimization of the package for high speed IC, as an example, a package for 5.5GHz frequency divider, includes model, parameter, simulation, analysis and optimization. In the end, the design results of the package are given.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125191966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dicing technology in super-thin wafer for IC 集成电路超薄晶圆的切割技术
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298708
Jian Jiang, Chunlan Song, Zheng-hong Zhang
{"title":"Dicing technology in super-thin wafer for IC","authors":"Jian Jiang, Chunlan Song, Zheng-hong Zhang","doi":"10.1109/EPTC.2003.1298708","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298708","url":null,"abstract":"A slice of silicon less than 200 /spl mu/m in thickness is needed for IC card wafers. Dicing the wafer with a grinding wheel is the universal method for many IC assembly plants, but hidden cracks on chips, bringing quality problems, often occur during the dicing process. This article gives intensive analysis and research from dicing theory and cracking causation to process improvement, at the same time it gives effective ways to solve the problem of chip cracking by choosing an appropriate dicing blade and using the new dicing technique of grooving.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"1996 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125567073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
X-ray inspection for electronic packaging latest developments 电子包装的x光检查最新发展
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298731
F. Maur
{"title":"X-ray inspection for electronic packaging latest developments","authors":"F. Maur","doi":"10.1109/EPTC.2003.1298731","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298731","url":null,"abstract":"During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of 5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115535150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
IMAPS NA - International Microelectronics and Packaging Society North America IMAPS NA -北美国际微电子和封装学会
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298683
P. Barnwell
{"title":"IMAPS NA - International Microelectronics and Packaging Society North America","authors":"P. Barnwell","doi":"10.1109/EPTC.2003.1298683","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298683","url":null,"abstract":"","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122342533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Research and development of electronic packaging technology in Taiwan 台湾电子封装技术的研究与开发
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298684
S. Fu, Rong-Shen Lee, T. Chen
{"title":"Research and development of electronic packaging technology in Taiwan","authors":"S. Fu, Rong-Shen Lee, T. Chen","doi":"10.1109/EPTC.2003.1298684","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298684","url":null,"abstract":"The research and development of electronic packaging technology in Taiwan are introduced. Basic researches are mostly conducted by university professors, and are supported by the National Science Council (NSC). Industrial packaging technologies are developed by research institutes, packaging companies - or jointly by research institute-industry and university-industry. Among all the research institutes, Industrial Technology Research Institute (ITRI) has devoted tremendous efforts on packaging technology.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130153075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Semicon Packaging Industry at Sanja Group 三佳集团半导体封装产业
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/eptc.2003.1298732
{"title":"Semicon Packaging Industry at Sanja Group","authors":"","doi":"10.1109/eptc.2003.1298732","DOIUrl":"https://doi.org/10.1109/eptc.2003.1298732","url":null,"abstract":"","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133310089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm 基于RSM分析和Ant算法的倒装芯片封装参数仿真优化研究
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI: 10.1109/EPTC.2003.1298698
Quanyong Li, Yu-bing Gong, Daoguo Yang, Junsheng Liang
{"title":"Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm","authors":"Quanyong Li, Yu-bing Gong, Daoguo Yang, Junsheng Liang","doi":"10.1109/EPTC.2003.1298698","DOIUrl":"https://doi.org/10.1109/EPTC.2003.1298698","url":null,"abstract":"In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"62 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133626322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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