电子包装的x光检查最新发展

F. Maur
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引用次数: 5

摘要

在过去几年中,x射线管和探测器技术都取得了进展。微聚焦放射镜已经成为一种重要的检测工艺,并已扩展到许多需要质量控制或工艺优化的新工业应用中。第一个纳米焦点和多焦点x射线系统已经可用,焦点为5微米。在现有的微聚焦x射线管范围内,也取得了进一步的改进,如增强了强度位置常数的长期稳定性。软件、图像处理和操作技术也都取得了进步,使得x射线成为几乎每个行业制造商的强大无损检测方法,特别是那些涉及电子封装的制造商。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
X-ray inspection for electronic packaging latest developments
During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of 5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging.
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