基于RSM分析和Ant算法的倒装芯片封装参数仿真优化研究

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298698

Quanyong Li, Yu-bing Gong, Daoguo Yang, Junsheng Liang

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引用次数: 1

摘要

本文介绍了一种基于仿真的优化方法，该方法将响应面法(RSM)与新开发的蚁群算法相结合。建立了主要封装参数与焊点等效应力最大值之间的近似函数。最后，利用蚁群算法对主要包装参数进行优化求解。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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