2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Comparison of cooling performance of manifold and straight microchannel heat sinks using CFD simulation","authors":"P. Zając","doi":"10.1109/EuroSimE52062.2021.9410853","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410853","url":null,"abstract":"Manifold microchannel heat sink is a promising alternative to the standard design with straight microchannels. Due to its inherent properties, it allows for better cooling performance and increased cooling efficiency. In this paper, we present the study which compares those two designs and tries to precisely quantify the cooling improvement obtained by using manifolds. Concretely, it is shown that for the same pressure drop, the cooling system based on manifold channels allows for about 50% reduction of temperature rise compared to the cooling system based on straight microchannels. Moreover, it is argued that manifold microchannels are most effective for shorter channels and faster fluid flows.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124915482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Aging of the Molding Compound Identification using Piezoresistive Silicon Based Stress Sensor","authors":"A. Prisacaru, P. Gromala","doi":"10.1109/EuroSimE52062.2021.9410837","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410837","url":null,"abstract":"Safety relevant electronics have applications in automotive field such as automated driving and electrification. The current distribution of the Electronic Control Units (ECU) will change to a centralized solution, such as Vehicle Control Units (VCU), comprising most of the car functions. Aging due to the thermal effects on molding compounds can play an important role in reliability predictions. During operation lifetime of the electronic package, the molding compound subjected to the thermal cycling and active loads can lead to changes in the mechanical material properties. These changes will make the current structural models inaccurate in evaluating reliability and durability. In this study, the oxidation effect captured by 120 piezoresistive stress sensitive cells packaged in a QFN automotive standard package is studied. The high temperature storage experiment consists of 2000h of $150^{circ}mathrm{C}$ of constant temperature. Considerable change during the experiment in mechanical stress are observed. Warpage measurements and cross-sections of the aged package are performed to explain the change in the stress. Cross-sections of QFN package are performed each 500h to determine the oxidation layer. Also, Finite Element Method is used to predict the mechanical stresses due to the mechanical properties changes of the oxidation layer.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128962149","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)","authors":"Antonio Pappaterra, B. Vandevelde, Majid Nazemi, Willem Verleysen, H. Oprins","doi":"10.1109/EuroSimE52062.2021.9410838","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410838","url":null,"abstract":"In this paper, a High-Performance direct liquid jet-impingement cooler is presented to guarantee the proper thermal operating conditions in High-Performance processors (up to 300W), enabling level 5 autonomous driving. Computational Fluid-Dynamics (CFD) simulations are performed on the 3D model to reach the final design iteration and show the superior performances. The 3D metal printability of a prototyped liquid-based printed cooler version and the integration to a chip is demonstrated, furthermore experiments are carried out to proof the validity of the CFD modeling methodology and the enhanced potentialities of the solution compared to possible cooling alternatives.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"219 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122460808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Towards Data Driven Failure Analysis Using Infrared Thermography","authors":"K. A. Pareek, D. May, M. A. Ras, B. Wunderle","doi":"10.1109/EuroSimE52062.2021.9410885","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410885","url":null,"abstract":"Electronic components of which reliability cannot be quantified are unacceptable and potentially hazardous, especially in safety-relevant areas such as driver assistance system and medical technology where the zero-error principle applies. Reliability as a quality criterion has its origin in production, i.e. process variations have a negative influence on the structural integrity of the contact elements on the packaging and interconnect technology and, thus on the device performance in the field under thermo-mechanical load (temperature changes, vibration, humidity). At present, to ensure reproducibility of the reliability of each component, regular quality tests are often carried out in practice. However, a better and reliable approach will carry out 100% inline checks for traceability and immediate readjustment. This work is the first step towards developing an intelligent non-destructive inline-capable failure analysis technique using infrared thermography. Good data forms the base on which robust and accurate AI algorithms can be trained and developed. However, the obtained thermographic images need to be processed so that subsurface defects can be detected. In this work, prominent algorithms, namely Pulse Phase Thermography (PPT), Thermographic Signal Reconstruction (TSR), Principal Component Analysis (PCT), Slope and Correlation Coefficient, have been thoroughly discussed and examined on the thermographic sequence from a plexiglass sample. A hybrid algorithm of TSR and PCT has also been suggested with promising results. In the end, potential post-processing algorithms from which the obtained results can be used for training an ML/AI model have been discussed.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134460837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package","authors":"A. Sitta, Giuseppe Mauromicale, G. Sequenzia, A. Messina, M. Renna, M. Calabretta","doi":"10.1109/EuroSimE52062.2021.9410870","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410870","url":null,"abstract":"Nowadays, solder reliability in new power electronic packages is an important research topic. Therefore, it is of paramount importance to properly understand and model the material behaviour and to develop a calculation model to predict reliability performances. This work presents a thermo-mechanical analysis of different solder layers for a low voltage discrete package. The solder joint reliability between package and PCB is also considered in the simulation. This modelling activity is possible by employing the Anand visco-plastic model and by means of a finite element model implemented in COMSOL. The number of cycles to failure can be subsequently computed, with the Darveaux method, for fatigue life estimation purpose.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"452 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134433629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Training Convolutional Neural Networks (CNN) for Counterfeit IC Detection by the Use of Simulated X-Ray Images","authors":"Suresh dharani Parasuraman, J. Wilde","doi":"10.1109/EuroSimE52062.2021.9410848","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410848","url":null,"abstract":"X-ray based non-destructive testing coupled with a deep learning approach in identifying counterfeit ICs is becoming state of the art. The features of the component under test such as copper lead frame and silicon chip are revealed by X-ray radiography, that forms the feature space to classify authentic or counterfeit component. The complexity in using deep learning algorithm is the dependence of convolutional neural networks performance on the large quantity of dataset for training. Obtaining these datasets consume an immense amount of time and work effort, which is prone to suffer from a change in the dimension of the base structure and material characteristics of the component under test. The aim is to construct a virtual X-ray simulation tool to generate synthetic radiographic images of the component under test and validate its effectiveness as training data for the convolutional neural network in identifying counterfeit component. The principle of perspective projection is used to compute the ray path length traversed through an object, and the interaction of a photon with the material is modeled using X-ray attenuation law. The tool is designed to import STL file with the possibility to assign material; for this purpose, the CAD model of the component under test and some counterfeits are developed through re-engineering steps. In total 2000 synthetic X-ray images of the CUT and 1500 X-ray images of counterfeit components are generated to train the CNN. An Image classification algorithm is constructed with VGG16 CNN model, trained with synthetic images and maximum prediction accuracy of 99.60% is attained.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132501071","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Vibration of Roadway Luminaires","authors":"G. Charlston, M. Shiue, W. V. van Driel, B. Jacobs","doi":"10.1109/EuroSimE52062.2021.9410863","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410863","url":null,"abstract":"This study intends to set up computational fluid dynamic simulations along with static and dynamic stress simulations to determine maximum possible accelerations and stress levels that may occur for poles having a single luminaire under certain typical and extreme environmental conditions.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132284317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Optical Deformation Measurement for Validation of Thermo-Mechanical FEM Models and Material Behavior in Electronics","authors":"R. Schwerz, M. Roellig, G. Lautenschlaeger","doi":"10.1109/EuroSimE52062.2021.9410868","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410868","url":null,"abstract":"The application of virtual evaluation tools based on the Finite Element Method (FEM) is already widespread in the field of electronics. At the assembly level, the geometries and material compositions of these models are often very complex and predominantly non-linear. To ensure the validity of the structural mechanic simulation models, it is always advisable to compare the calculation results with real measured data of experiment. This validation allows the evaluation of the model quality, provides information about the limits of material models and increases the credibility of the calculation results. One possibility for experimental verification is the optical measurement of the deformations and evaluation by digital image correlation. In this paper, optical measurement setups are presented, which have been specifically designed for the measurement of the thermo-mechanical deformation field on the structures of electronics and their assembly and interconnection technology. Therefore, the measurement setup needs to detect deformations in the range of a few micrometers in a wide temperature range. The physical understanding of the transient heating of the test specimen is essential for the accuracy of the deformation fields to be determined. Two suitable setups are shown. One is for smaller samples like packages (ODU-1) while the second one ODU-2 has been designed with PCB-board size samples in mind. ODU-1 has been accompanied by numerical flow simulation (CFD) to combine a good understanding of fluid mechanics with the transient thermo-mechanics of the test specimen. Based on the simulation results and measurements of test specimens, measures were derived and implemented to achieve the necessary high measurement accuracy. Deep understanding of the accuracy of deformation measurements has shown that a temperature ramp of 1K/min is a good compromise between speed and accuracy. The measurements were carried out on samples designed for future power electronics applications and consisted of thick copper and polymer crossings with a novel technology. The measured deformation fields agree well with the calculations of the corresponding FE models at the same thermo-mechanical load. Furthermore, the shown measurements indicate crack development due to environmental loads. These cracks could be detected with DIC and were also evident in x-ray inspection. This leads to the conclusion that optical deformation measurement is a valuable tool in reliability analysis to support simulation verification and also support inspections towards interface cracking.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122088807","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical and Experimental Study on Determination Method of Elastoplastic Properties for Indentation Testing","authors":"K. Kariya, N. Masago","doi":"10.1109/EuroSimE52062.2021.9410866","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410866","url":null,"abstract":"Instrumented indentation testing is a technique for measuring the local mechanical properties of materials, and is expected to be applied to various fields. Although the depth-sensing indentation method is common, recently, the method that can sense the indentation contact area has been marketed, and it allows accurate determination of the applied stress value, which has been a problem in the past. In this study, we discuss the methodology for determining the mechanical properties of elastoplastic materials using the depth-sensing and the area-sensing indentation technique. A numerical study using finite element analysis and experimental verification was presented.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125601004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Geometrically Parametrized Reduced Order Model of a Miniaturized Thermoelectric Generator for Electrically Active Implants","authors":"C. Yuan, T. Bechtold","doi":"10.1109/EuroSimE52062.2021.9410842","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410842","url":null,"abstract":"Design optimization process of thermoelectric generators can be performed in finite element software and speeded up by mathematical methods of parametric model order reduction. In order to investigate the impact of the geometry changes, e.g., the matrix-interpolation based parametric model order reduction method can be utilized to generate compact, but highly accurate parametric reduced order models for efficient parametric studies. However, an important prerequisite for this method is that the finite element mesh of the model remains the same with the changing of the geometrical parameters. In this work, we present a geometry parameterizing strategy to obtain a constant mesh in the model.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"237 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132358482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}