Antonio Pappaterra, B. Vandevelde, Majid Nazemi, Willem Verleysen, H. Oprins
{"title":"Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)","authors":"Antonio Pappaterra, B. Vandevelde, Majid Nazemi, Willem Verleysen, H. Oprins","doi":"10.1109/EuroSimE52062.2021.9410838","DOIUrl":null,"url":null,"abstract":"In this paper, a High-Performance direct liquid jet-impingement cooler is presented to guarantee the proper thermal operating conditions in High-Performance processors (up to 300W), enabling level 5 autonomous driving. Computational Fluid-Dynamics (CFD) simulations are performed on the 3D model to reach the final design iteration and show the superior performances. The 3D metal printability of a prototyped liquid-based printed cooler version and the integration to a chip is demonstrated, furthermore experiments are carried out to proof the validity of the CFD modeling methodology and the enhanced potentialities of the solution compared to possible cooling alternatives.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"219 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EuroSimE52062.2021.9410838","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In this paper, a High-Performance direct liquid jet-impingement cooler is presented to guarantee the proper thermal operating conditions in High-Performance processors (up to 300W), enabling level 5 autonomous driving. Computational Fluid-Dynamics (CFD) simulations are performed on the 3D model to reach the final design iteration and show the superior performances. The 3D metal printability of a prototyped liquid-based printed cooler version and the integration to a chip is demonstrated, furthermore experiments are carried out to proof the validity of the CFD modeling methodology and the enhanced potentialities of the solution compared to possible cooling alternatives.