2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第6页

Time-based Reliability Analysis of Electrolytic Capacitors for Automotive Applications Using Multi-Domain Simulation 基于多域仿真的汽车用电解电容器时间可靠性分析

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410882

Philipp Adler, R. Mallwitz

引用次数: 2

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics 微电子用聚合物封装材料固化诱导残余应力的预测

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410855

C. Schipfer, M. Gschwandl, P. Fuchs, T. Antretter, M. Feuchter, Matthias Morak, Q. Tao, A. Schingale

{"title":"Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics","authors":"C. Schipfer, M. Gschwandl, P. Fuchs, T. Antretter, M. Feuchter, Matthias Morak, Q. Tao, A. Schingale","doi":"10.1109/EuroSimE52062.2021.9410855","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410855","url":null,"abstract":"Surface Mounted Devices (SMDs) are widely spread throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production in e.g a RTM process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension to the work of Gschwandl. et al [1] and includes a stress-free deformation before vitrification, changing material properties during curing as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and help optimizing the production cycle of SMDs.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128421710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Using AFM Measurements for Failure Indication During High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers 在MEMS悬臂梁的金属薄膜高周疲劳试验中使用AFM测量进行失效指示

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410876

V. Osipova, N. Jöhrmann, J. Heilmann, D. May, J. Arnold, T. Bieniek, R. Pufall, B. Wunderle

{"title":"Using AFM Measurements for Failure Indication During High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers","authors":"V. Osipova, N. Jöhrmann, J. Heilmann, D. May, J. Arnold, T. Bieniek, R. Pufall, B. Wunderle","doi":"10.1109/EuroSimE52062.2021.9410876","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410876","url":null,"abstract":"We use Si MEMS cantilevers as sample carriers to gain high cycle fatigue data for thin metal films by accelerated stress testing. A typical number of 107 cycles can thus be achieved in a couple of hours. A closed loop control using laser beam deflection allows to keep the load on the thin film constant while in parallel its degradation is monitored continuously by recording resonance frequency, thin layer electrical resistance and surface roughness, the latter ex situ by AFM. We show a correlation between those three failure indicators and motivate a relationship with the failure parameter within a physics-of-failure based reliability paradigm. The proposed method opens an introspect view on the degradation behaviour of thin metal films as well as a rapid statement on their reliability under vibration loading at different temperatures. In this paper, the method is exemplified on the disruption of $1.2 mu mathrm{m}$ thin sputtered Aluminium layers.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131539467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model 烧结纳米银粒子的本构模型:变阶分数模型与Anand模型

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410807

Jiajie Fan, Tijian Gu, Ping Wang, W. Cai, Xuejun Fan, Guoqi Zhang

{"title":"Constitutive Modeling of Sintered Nano-silver Particles: A Variable-order Fractional Model versus an Anand Model","authors":"Jiajie Fan, Tijian Gu, Ping Wang, W. Cai, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EuroSimE52062.2021.9410807","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410807","url":null,"abstract":"In high-power electronics packaging, nano-silver sintering technology has been widely applied due to its excellent electrical and thermal conductivity and its low-temperature packaging and high-temperature operation. In this study, 50-nm nano-silver particles are sintered at 275°C for 50 min and placed under a dynamic thermomechanical analyzer (DMA Q800) with three strain rates (0.001%s-1, 0.01%s-1, and 0.1%s-1) and seven ambient temperatures (-40°C, 0°C, 25°C, 60°C, 120°C, 150°C, and 185°C). Both the variable-order fractional constitutive model and Anand model are adopted to characterize the tensile behaviors of sintered nano-silver particles. The results show that (1) the tensile strength of sintered nano-silver particle samples declines under the lower strain rate and higher temperature; and (2) both the variable-order fractional model and Anand model can well represent the tensile mechanical properties of sintered nano-silver. According to the root mean square error (RMSE) calculation, the fitting accuracy of the variable-order fractional model is slightly better than that of the Anand model. Furthermore, the variable-order fractional model involves fewer parameters, which makes it easier to fit than the Anand model.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130892918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Design of a PMUT array for Multifrequency Imaging 用于多频成像的PMUT阵列设计

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410846

B. Weekers, M. Billen, R. Haouari, V. Rochus

引用次数: 1

A comparative study of acoustic isolation configurations for pMUT array-based applications 基于pMUT阵列应用的隔声配置比较研究

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410867

B. Vysotskyi, R. Haouari, B. Weekers, G. Keulemans, G. Torri, V. Rochus

引用次数: 3

Deep Learning of the SSL Luminaire Spectral Power Distribution under Multiple Degradation Mechanisms by Hybrid kNN algorithm 基于混合kNN算法的SSL灯具多退化机制下光谱功率分布深度学习

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410872

Cadmus C A Yuan

引用次数: 1

Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR 汽车激光雷达数字孪生中的热-机械-光学耦合

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410831

M. Tavakolibasti, P. Meszmer, G. Böttger, M. Kettelgerdes, G. Elger, H. Erdogan, A. Seshaditya, B. Wunderle

引用次数: 7

Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates 氮化硅芯片与铜衬底之间焊接和烧结互连中应力现象的模拟和实验分析

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2021-04-19 DOI: 10.1109/EuroSimE52062.2021.9410869

E. Liu, F. Conti, Sri Krishna Bhogaraju, G. Elger

{"title":"Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates","authors":"E. Liu, F. Conti, Sri Krishna Bhogaraju, G. Elger","doi":"10.1109/EuroSimE52062.2021.9410869","DOIUrl":"https://doi.org/10.1109/EuroSimE52062.2021.9410869","url":null,"abstract":"Thermomechanical stress in microelectronics packaging systems is a very complex phenomenon. Understanding of behaviours of the systems, in terms of origin, assessment and impact of the stress on an assembly, is a successful strategy to develop devices with high performances and reliability. Based on the fine element method, virtual prototypes can be investigated to simulate the thermomechanical behaviour and stress in real assemblies. Micro-Raman spectroscopy is a valid method to determine the stress distribution in a material because the perturbation due to stress can be observed as variation of wavenumber of phonon modes. In this paper, a FEM model is developed and experimental results of Raman investigations are compared to the theoretical results obtained from the model. The model and the processing approach are validated by the analysis of the stress in test assembles where $Si_{3} mathrm{N}_{4}$ chips are bonded onto Cu substrates via AuSn-soldering, SAC305-soldering, and Cu-sintering. Compressive stress with values between 150 and 1100 MPa is determined in $Si_{3} mathrm{N}_{4}$ /AuSn/Cu assemblies.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129563124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Failure Strength Weibull Analysis of 4H-SiC Die through a 3-PB test 4H-SiC模具3-PB失效强度威布尔分析

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2020-12-22 DOI: 10.1109/EuroSimE52062.2021.9410881

Antonio Landi, A. Mon, L. Liaci, A. Sitta, M. Calabretta, A. Sciuto, G. D'Arrigo, M. Renna, V. Vinciguerra

引用次数: 1