Antonio Pappaterra, B. Vandevelde, Majid Nazemi, Willem Verleysen, H. Oprins
{"title":"用于自动驾驶高性能车载计算机(HPVC)的先进(金属3d打印)直接液体喷射冲击冷却解决方案","authors":"Antonio Pappaterra, B. Vandevelde, Majid Nazemi, Willem Verleysen, H. Oprins","doi":"10.1109/EuroSimE52062.2021.9410838","DOIUrl":null,"url":null,"abstract":"In this paper, a High-Performance direct liquid jet-impingement cooler is presented to guarantee the proper thermal operating conditions in High-Performance processors (up to 300W), enabling level 5 autonomous driving. Computational Fluid-Dynamics (CFD) simulations are performed on the 3D model to reach the final design iteration and show the superior performances. The 3D metal printability of a prototyped liquid-based printed cooler version and the integration to a chip is demonstrated, furthermore experiments are carried out to proof the validity of the CFD modeling methodology and the enhanced potentialities of the solution compared to possible cooling alternatives.","PeriodicalId":198782,"journal":{"name":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"219 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)\",\"authors\":\"Antonio Pappaterra, B. Vandevelde, Majid Nazemi, Willem Verleysen, H. Oprins\",\"doi\":\"10.1109/EuroSimE52062.2021.9410838\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a High-Performance direct liquid jet-impingement cooler is presented to guarantee the proper thermal operating conditions in High-Performance processors (up to 300W), enabling level 5 autonomous driving. Computational Fluid-Dynamics (CFD) simulations are performed on the 3D model to reach the final design iteration and show the superior performances. The 3D metal printability of a prototyped liquid-based printed cooler version and the integration to a chip is demonstrated, furthermore experiments are carried out to proof the validity of the CFD modeling methodology and the enhanced potentialities of the solution compared to possible cooling alternatives.\",\"PeriodicalId\":198782,\"journal\":{\"name\":\"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"219 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EuroSimE52062.2021.9410838\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EuroSimE52062.2021.9410838","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced (Metal 3D-Printed) Direct Liquid Jet-Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)
In this paper, a High-Performance direct liquid jet-impingement cooler is presented to guarantee the proper thermal operating conditions in High-Performance processors (up to 300W), enabling level 5 autonomous driving. Computational Fluid-Dynamics (CFD) simulations are performed on the 3D model to reach the final design iteration and show the superior performances. The 3D metal printability of a prototyped liquid-based printed cooler version and the integration to a chip is demonstrated, furthermore experiments are carried out to proof the validity of the CFD modeling methodology and the enhanced potentialities of the solution compared to possible cooling alternatives.