International Symposium on Laser Metrology最新文献_第5页

Influence of iodine cell quality onto the stability and absolute frequency shifts of laser etalons 碘电池质量对激光标准子稳定性和绝对频移的影响

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814576

J. Hrabina, J. Lazar, P. Jedlicka, O. Cíp

{"title":"Influence of iodine cell quality onto the stability and absolute frequency shifts of laser etalons","authors":"J. Hrabina, J. Lazar, P. Jedlicka, O. Cíp","doi":"10.1117/12.814576","DOIUrl":"https://doi.org/10.1117/12.814576","url":null,"abstract":"Frequency doubled Nd:YAG lasers are often the option with stabilization to the saturated absorption in molecular iodine featuring good signal-to-noise ratio at the 532 nm. Purity of iodine in the absorption cell is one of the most important factor how to achieve results in optical frequencies corresponding to theoretical values. We present results of measurement of purity of sets of iodine cells made at our institute. The purity was tested by improved method based on measurement of induced fluorescence and evaluation by the Stern-Volmer formula. Frequency-doubled Nd:YAG lasers stabilized with these cells were compared to evaluate their frequency shifts. The absolute frequencies of selected iodine hyperfine transitions were measured in direct laser frequency comparison with the reproducibility well below the kHz level. The results indicating the iodine cell purity are presented with relation to the absolute frequency shifts. This not only highlights the influence of iodine cell quality onto the stability and absolute frequency of lasers etalons but also shows the way towards improvements of the iodine cell manufacturing technology.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115039255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Vibration influence and error compensation of aspherical surface interferometer 非球面干涉仪的振动影响及误差补偿

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814605

Hongjun Wang, Jianfeng Cao, A. Tian, Bingcai Liu

{"title":"Vibration influence and error compensation of aspherical surface interferometer","authors":"Hongjun Wang, Jianfeng Cao, A. Tian, Bingcai Liu","doi":"10.1117/12.814605","DOIUrl":"https://doi.org/10.1117/12.814605","url":null,"abstract":"In the technology of aspherical surface measurement, the phase shifting aspherical surface interferometer have widely used, but the vibration error from the environment is the main factor that directly affects the measurement accuracy of the phase shifting interferometer. In this paper, based on the structure of lateral shearing aspherical surface interferometer, the resources and sorts of vibration error were introduced, and some methods to eliminate errors were mentioned. The vibration influence on measurement results was analyzed. In order to reduce error, a new error compensation algorithm was put forward. In this method, first, a vibration measurement theory was built. Then Based on optic-electrical detection technology and image acquisition system and image process technology, the vibration mode of lateral shearing interferometer was obtained. Finally the vibration error of fringe image can be compensated by image correction. The measurement results can be obtained by the four-step phase shifting interferogram. The theoretical analysis and simulative results demonstrate the feasibility of this approach to improve measurement accuracy.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129348146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Study on topography measurement of ultra-smooth surface 超光滑表面形貌测量方法研究

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814593

Yuhe Li, Xi-Peng Tong, H. Lin, Huiyu Li, Qingxiang Li

引用次数: 0

Evaluation on the probing error of a micro-coordinate measuring machine 微坐标测量机探测误差的评价

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814519

Z. Chao, S. L. Tan, G. Xu

{"title":"Evaluation on the probing error of a micro-coordinate measuring machine","authors":"Z. Chao, S. L. Tan, G. Xu","doi":"10.1117/12.814519","DOIUrl":"https://doi.org/10.1117/12.814519","url":null,"abstract":"Micro-coordinate measuring machines (micro-CMMs) with small probes (φ300 μm or smaller), low probing force and high accuracy working stage have been developed in recent years for three-dimensional (3D) measurement of micro structures. In general, the performance of the micro-CMM depends on the accuracy of its working stage and the probing system. The accuracy of the working stage of a micro CMM can be assessed by laser interferometry to the order of a few tens of nanometers. However, the accuracy of its probing system is difficult to assess due to the small probe size and low probing force. The probing error of a micro-CMM (model F25 by Carl Zeiss) was investigated at our laboratory. The probes used in the system are based on silicon membrane and piezo-resistive elements. The stylus size of the probes ranges from φ120 μm to φ300 μm. The effect of various sources, including the stylus size, on the probing error of the system was evaluated by means of certified precision spheres with reference to ISO 10360-2:2001. Based on the results obtained, possible ways to reduce the probing error are discussed. This is illustrated by the uncertainty analysis of the diameter measurements of a ring gauge using the system.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127456006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Sub-pixel matching with consideration of lens distortion 考虑镜头畸变的亚像素匹配

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814591

Shihao Dong, Xiao-bo Zhao, Yongkai Yin, Jindong Tian, Xiang Peng

引用次数: 1

Static and dynamic 3D contouring by using structured light 静态和动态3D轮廓使用结构光

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814584

R. Rodríguez-Vera, D. Vasquez, K. Genovese, J. Rayas, F. Mendoza-Santoyo

{"title":"Static and dynamic 3D contouring by using structured light","authors":"R. Rodríguez-Vera, D. Vasquez, K. Genovese, J. Rayas, F. Mendoza-Santoyo","doi":"10.1117/12.814584","DOIUrl":"https://doi.org/10.1117/12.814584","url":null,"abstract":"Non-destructive optical techniques for 3D shape measuring are fundamental in science, engineering, medicine, and industry. Such 3D data offer advantages over 2D data: shape data are invariant against alteration of the illumination and object motion. One of the major and easy methods to obtain 3D shape is from its contours. There exist several optical techniques for contouring, but the easiest to put into operation is by using linear structured light projection. The present work focuses on the implementation of linear structured light projection techniques for static and dynamic 3D contouring at macro- and micro-levels. Linear structured light as a fringe pattern is projected on the surface to be contoured. White light and laser-illuminating Talbot image are used in order to project the fringe pattern. Projected fringe pattern is captured by a conventional or high-speed CCD camera for image digitalizing and further analysis. Fourier transform method is employed as a tool to obtain a contour-wrap optical phase map. The simple experimental arrangement is adapted for static or dynamic conditions of the surface to contour. Samples that are under harmonic vibration conditions, for example, their vibrating frequency is tuned with that of the capture CCD camera to obtain the mode shape. In the static case one can obtain the topographical comparison before and after the surface subject to a static load or simply its topography. Examples, at micro and macro levels, of static and dynamics surface conditions are shown.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116071050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Inspection of electroplated gold 电镀金检验

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814590

T. W. Ng, F. Yong

引用次数: 0

The high resolution actuator based on giant magnetostriction 基于超磁致伸缩的高分辨率驱动器

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814608

Lei Wang, Jiubin Tan, Shan Zhang

引用次数: 0

Moire fringe method for the measurement of distortions of hot-embossed polymeric substrates 热压聚合物基材变形测量的云纹条纹法

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814582

H. Taylor, Zhiguang Xu, Shiguang Li, K. Youcef-Toumi, Y. S. Fatt, D. Boning

{"title":"Moire fringe method for the measurement of distortions of hot-embossed polymeric substrates","authors":"H. Taylor, Zhiguang Xu, Shiguang Li, K. Youcef-Toumi, Y. S. Fatt, D. Boning","doi":"10.1117/12.814582","DOIUrl":"https://doi.org/10.1117/12.814582","url":null,"abstract":"We present a way to identify distortions of transparent micro-patterned substrates using a desktop document scanner and a set of image processing routines. The method requires neither expensive optical equipment nor precise positioning of the part. It is therefore ideally suited to rapid process monitoring. A 5000-dpi imagesetter is used to print a square reference grid of lines having a known pitch ~100 μm. This reference pattern is used to produce a hard stamp that is subsequently embossed into a sheet of thermoplastic polymer. The pattern transferred to the polymer may include distortions resulting from contraction of the sheet after separation from the stamp. To measure these distortions, the embossed polymeric part is placed on a document scanner. The reference grid is laid on top of the part and rotated by hand until moire fringes are seen. At least two scans are made, each with a different relative reference-part rotation. For each scan, the orientation of the part relative to the reference grid may be arbitrarily chosen within an allowable range of a few degrees. These orientations may be extracted from the captured images, and, together with the moire fringes' orientations and spacings, provide enough information to obtain the part's distortions. Estimates of part strains may be improved, at the expense of measurement time, by capturing more images. The approach can detect isotropic shrinkage of the part with a strain resolution ~10-3.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122460109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Residual stress in silicon wafer using IR polariscope 用红外偏振光分析硅片的残余应力

International Symposium on Laser Metrology Pub Date : 2008-09-29 DOI: 10.1117/12.814538

Zhijian G. Lu, Pin Wang, A. Asundi

{"title":"Residual stress in silicon wafer using IR polariscope","authors":"Zhijian G. Lu, Pin Wang, A. Asundi","doi":"10.1117/12.814538","DOIUrl":"https://doi.org/10.1117/12.814538","url":null,"abstract":"The infrared phase shift polariscope (IR-PSP) is a full-field optical technique for stress analysis in Silicon wafers. Phase shift polariscope is preferred to a conventional polariscope, as it can provide quantitative information of the normal stress difference and the shear stress in the specimen. The method is based on the principles of photoelasticity, in which stresses induces temporary birefringence in materials which can be quantitatively analyzed using a phase shift polariscope. Compared to other stress analysis techniques such as x-ray diffraction or laser scanning, infrared photoelastic stress analysis provides full-field information with high resolution and in near real time. As the semiconductor fabrication is advancing, larger wafers, thinner films and more compact packages are being manufactured. This results in a growing demand of process control. Residual stress exist in silicon during semiconductor fabrication and these stresses may make cell processing difficult or even cause the failure of the silicon. Reducing these stresses would improve manufacturability and reliability. Therefore stress analysis is essential to trace the root cause of the stresses. The polariscope images are processed using MATLAB and four-step phase shifting method to provide quantitative as well as qualitative information regarding the residual stress of the sample. The system is calibrated using four-point bend specimen and then the residual stress distribution in a MEMS sample is shown.","PeriodicalId":191475,"journal":{"name":"International Symposium on Laser Metrology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125263196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1