2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems最新文献_第6页

Frequency domain analysis of jitter amplification in clock channels 时钟通道中抖动放大的频域分析

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457841

F. Rao, S. Hindi

引用次数: 21

On aperture coupling based compact system of lens enhanced phased array 基于孔径耦合的透镜增强相控阵紧凑系统研究

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457899

Lisha Zhang, A. Abbaspour-Tamijani, G. Pan, H. Pan

引用次数: 1

A mixed-domain behavioral model's extraction for digital I/O buffers 数字I/O缓冲区混合域行为模型的提取

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457882

W. Dghais, T. Cunha, J. Pedro

引用次数: 8

Current distribution and internal impedance of interconnect 互连电流分布和内部阻抗

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457903

Hongsheng Xu, Jiming Song, T. Kamgaing

引用次数: 0

Simultaneous switching noise analysis of reference voltage rails for pseudo differential interfaces 伪差分接口参考电压轨同步开关噪声分析

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457840

Sung Joo Park, J. Choi, Madhavan Swaminathan

引用次数: 1

Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design 三维集成电路上多通硅孔(TSV)串扰建模:实验验证及其在法拉第笼设计中的应用

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457884

Yu-Jen Chang, Hao-Hsiang Chuang, Yi-Chang Lu, Y. Chiou, Tzong-Lin Wu, P. Chen, Shih-Hsien Wu, T. Kuo, C. Zhan, W. Lo

引用次数: 23

A compact on-interposer passive equalizer for chip-to-chip high-speed data transmission 用于芯片到芯片高速数据传输的紧凑型介入器无源均衡器

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457851

Heegon Kim, Jonghyun Cho, Joohee Kim, Kiyeong Kim, Sumin Choi, Joungho Kim, J. Pak

引用次数: 7

System-level performance optimization and benchmarking for on-chip graphene interconnects 片上石墨烯互连的系统级性能优化和基准测试

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457837

C. Pan, A. Naeemi

引用次数: 7

Thermal characterization of TSV based 3D stacked ICs 基于TSV的3D堆叠ic热特性研究

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457910

S. Swarup, S. Tan, Zao Liu

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引用次数: 9

Electrical interconnect design for testing of high-speed IC transceivers 高速集成电路收发器测试的电气互连设计

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI: 10.1109/EPEPS.2012.6457842

R. Rímolo-Donadío, C. Baks, B. Lee, J. H. Song, X. Gu, Y. Kwark, D. Kuchta, A. Rylyakov, C. Schow

引用次数: 1