{"title":"Hardware Module Design for Ensuring Trust","authors":"A. Fournaris","doi":"10.1109/ISVLSI.2010.80","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.80","url":null,"abstract":"Trust in security demanding software platforms is a very important characteristic. For this reason, Trusted computing group has specified a TPM hardware module that can enforce and guaranty a high trust level to all the platform's involved entities. However, the TPM's features can not be fully exploited in systems under extreme physical conditions. To solve this problem, the use of a special purpose hardware module, physically connected to a host security system's device acting as a local trusted third party, has been proposed. In this paper, we propose a hardware structure of such a hardware module, called Autonomous Attestation Token (AAT) and discuss hardware resource constrains and security bottlenecks that can stem from improper design of its various components. From this analysis it can be concluded that the efficiency of the AAT system is closely related to the efficiency of its public key encryption-decryption unit (RSA encryption-decryption module). Thus, we propose a design methodology toward a low hardware resources (small chip covered area) and side channel attack resistant RSA hardware architecture. This architecture is based on a Fault and Simple power attack resistant version of CRT RSA algorithm that is optimized for the AAT core functionality and hardware structure. To achieve that, Montgomery modular multiplication is used with numbers in carry save format and a Fault and simple power attack resistant modular exponentiation algorithm (FSME) is developed based on this multiplication approach. The hardware structure, realizing the FSME algorithm, is the most complex and resource demanding part of the CRT RSA architecture and its behavior is discussed after implementing it in FPGA technology. The proposed architecture's implementation provides very optimistic results of very low chip covered area and high computation speed thus verifying the efficiency of the proposed algorithms and architecture design approach.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128877562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"European ICT Research: 2011-2012 Outlook for Components and Systems","authors":"P. Tsarchopoulos","doi":"10.1109/ISVLSI.2010.116","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.116","url":null,"abstract":"In 2011-2012, the European ICT research priorities are focused on a set of Challenges with mid-to-long term goals that require trans-national collaboration. Each Challenge is addressed through a limited set of objectives that form the basis for Calls for Proposals and lead to EU-funded research projects. One of the Challenges addresses \"Alternative Paths to Components and Systems\", it covers nanoelectronic devices and components, photonics, integrated micro/nanosystems, multicore computing systems and embedded systems.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116505651","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Logical Core Algorithm: Improving Global Placement","authors":"Felipe Pinto, L. Cavalheiro, M. Johann, R. Reis","doi":"10.1109/ISVLSI.2010.114","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.114","url":null,"abstract":"This work introduces a new technique to improve the global placement, which can be applied to any regular placer. We propose an algorithm called Logical Core, based on Google PageRankâ, which distributes probability weights to every cell in the circuit netlist. Then, these weights are used to select the most important cells for the global placement. By using this information, we are able to improve global placement in terms of wirelength. The Logical Core algorithm proposes a new complexity rule to the placement graph. This complexity has a great similarity with the Rent’s Rule. The technique improves the total wirelength in all tested cases by 4.5%.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134634315","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Reliability Analysis and Improvement in Nano Scale Design","authors":"Mahtab Niknahad, M. Hübner, J. Becker","doi":"10.1109/ISVLSI.2010.48","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.48","url":null,"abstract":"According to the shrinking feature size of the VLSI circuits it is expected that nano scale devices and interconnections will introduce unprecedented level of defects and architectural designs need to settle with the uncertainty result at such scales. Several approaches for implementing the fault tolerance systems are already investigated. Most of these methods are applicable also in the case of high fault rates. Most protection methods are based on different redundancy methods which add extra detection and correction features to the design. We strongly believe that in future architectures it become more important assessing the fault tolerance techniques. Having an estimation of system fault tolerance can ensure critical applications working properly. In this work we propose a new method which checks reconfigurable architectures and during runtime finds violent spots in the design for probable transient and permanent failures. This approach is adjustable to either current FPGAs or future nano-architectures which are based on reconfigurability. We define a fault detection model for probable errors which uses an efficient algorithm that proves the fault tolerance in the reconfigurable architecture and computes a reliability factor for the architecture. This helps avoiding using the critical parts by future usages. Our method is applicable to different levels of granularity, such as gate level, logic block level, logic function level, unit level, etc. It is efficient and fast and can be simply integrated into the design flow.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133657753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"System Level Design of Complex Hardware Applications Using ImpulseC","authors":"Georgia Kalogeridou, N. Voros, K. Masselos","doi":"10.1109/ISVLSI.2010.10","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.10","url":null,"abstract":"This paper presents an approach for the design of complex hardware applications using a system level design technique based on ImpulseC design language. ImpulseC is an industry standard language that offers a full design environment of mixed hardware/software systems. The goal of this paper is to evaluate the applicability of ImpulseC design environment for the design of the physical layer of modern wireless communication protocols.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133022496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Ebrahimi, M. Daneshtalab, P. Liljeberg, H. Tenhunen
{"title":"Performance Analysis of 3D NoCs Partitioning Methods","authors":"M. Ebrahimi, M. Daneshtalab, P. Liljeberg, H. Tenhunen","doi":"10.1109/ISVLSI.2010.26","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.26","url":null,"abstract":"3D IC design improves performance and decreases power consumption by replacing long horizontal interconnects with short vertical ones. Achieving higher performance along with reducing the network latency can be obtained by utilizing an efficient communication protocol in 3D Networks-on-Chip (NoCs). In this work, several unicast/multicast partitioning methods are explained in order to find an advantageous method with low communication latency. Moreover, two factors of efficiency, unicast latency and multicast latency, are analyzed by analytical models. We also perform simulation to compare the efficiency of proposed methods. The results show that Mixed Partitioning method outperforms other methods in term of latency.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"41 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129311581","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Small Worlds: The Dynamics of NoCs in Tomorrow SoC Architecture","authors":"M. Coppola","doi":"10.1109/ISVLSI.2010.112","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.112","url":null,"abstract":"Consumer electronics (CEs) is mainly characterized by its heterogeneity in products and markets. Moreover, large companies like Google, YouTube, Myspace, are revolutionizing the way to provide information contents. Today, several new CE devices have been introduced in the marketplace for receiving, visualizing, communicating, creating, and sending information. This changing implies that end-users are looking for devices with more features, better quality and elegant and simple user interface. This trend has a big impact on the features that System-on-Chips (SoC) have to support.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124675317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Iasonas Filippopoulos, Iraklis Anagnostopoulos, A. Bartzas, D. Soudris, G. Economakos
{"title":"Systematic Exploration of Energy-Efficient Application-Specific Network-on-Chip Architectures","authors":"Iasonas Filippopoulos, Iraklis Anagnostopoulos, A. Bartzas, D. Soudris, G. Economakos","doi":"10.1109/ISVLSI.2010.60","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.60","url":null,"abstract":"Network-on-Chip (NoC), a new System-on-Chip paradigm, has been proposed as a solution to mitigate complex on-chip interconnection problems. NoC architectures are able to accommodate a large number of IP cores in the same chip implementing a set of complex applications. Especially, custom NoC topologies are able to further increase application’sperformance due to their adaptiveness. In this paper, we present a systematic methodology for generating an energy efficient application-specific NoC architecture. The methodology framework consists of the following steps: 1) greedy application partitioning, 2) automatic topology generation and extensive exploration, and 3) an energy-aware router optimization so as to find the best architecture that meets applications requirements. Validation of the proposed framework was performed using four DSP/multimedia applications showing that energy-aware irregular NoCs can achieve on average 53% energy reduction, without violating applications timing constrains.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124074873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
N. Onizawa, Tomoyoshi Funazaki, Atsushi Matsumoto, T. Hanyu
{"title":"Accurate Asynchronous Network-on-Chip Simulation Based on a Delay-Aware Model","authors":"N. Onizawa, Tomoyoshi Funazaki, Atsushi Matsumoto, T. Hanyu","doi":"10.1109/ISVLSI.2010.45","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.45","url":null,"abstract":"A performance-evaluation simulator, such as a cycle-accurate simulator, is a key tool for exploring appropriate asynchronous Network-on-Chip (NoC) architectures in early stages of VLSI design, but its accuracy is insufficient in practical VLSI implementation. In this paper, a highly accurate performance-evaluation simulator based on a delay-aware model is proposed for implementing an appropriate asynchronous NoC system. While the unit delay between circuit blocks at every pipeline stage is constant in the conventional cycle-accurate simulator, which causes poor accuracy, the unit delay between circuit blocks in the proposed approach is determined independently by its desirable logic function. The use of this ”delay-aware” model makes it accurate to simulate asynchronous NoC systems. As a design example, a 16-core asynchronous Spider on NoC system is simulated by the conventional cycle-accurate and the proposed simulator whose results, such as latency and throughput, are validated with a highly precise transistor-level simulation result. As a result, the proposed simulator achieves almost the same accuracy as one of the transistor-level simulators with the simulation speed comparable to the cycle-accurate simulator.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122550450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Simulation Based Feasibility Study of Wireless RF Interconnects for 3D ICs","authors":"A. More, B. Taskin","doi":"10.1109/ISVLSI.2010.33","DOIUrl":"https://doi.org/10.1109/ISVLSI.2010.33","url":null,"abstract":"A feasibility study of inter-tier wireless interconnects to be used in conjunction with through silicon vias (TSVs) for global communication in 3D ICs is presented. The feasibility is shown by performing a full wave electromagnetic analysis of on-chip communicating antennas in a 3D IC, modeled according to a fully-depleted silicon on insulator (FDSOI) 3D circuit integration technology. It is shown that the selected transmitting and receiving antennas provide a strong signal coupling at the adjacent (-6.67 dB) and the non-adjacent (-6.93 dB) tiers of the 3D IC at a radiation frequency of 10GHz. In addition to permitting non-adjacent tier communication, wireless interconnects are superior to TSVs in permitting non-vertically aligned connections between IC tiers.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"228 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122690401","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}