{"title":"基于仿真的3D集成电路无线射频互连可行性研究","authors":"A. More, B. Taskin","doi":"10.1109/ISVLSI.2010.33","DOIUrl":null,"url":null,"abstract":"A feasibility study of inter-tier wireless interconnects to be used in conjunction with through silicon vias (TSVs) for global communication in 3D ICs is presented. The feasibility is shown by performing a full wave electromagnetic analysis of on-chip communicating antennas in a 3D IC, modeled according to a fully-depleted silicon on insulator (FDSOI) 3D circuit integration technology. It is shown that the selected transmitting and receiving antennas provide a strong signal coupling at the adjacent (-6.67 dB) and the non-adjacent (-6.93 dB) tiers of the 3D IC at a radiation frequency of 10GHz. In addition to permitting non-adjacent tier communication, wireless interconnects are superior to TSVs in permitting non-vertically aligned connections between IC tiers.","PeriodicalId":187530,"journal":{"name":"2010 IEEE Computer Society Annual Symposium on VLSI","volume":"228 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Simulation Based Feasibility Study of Wireless RF Interconnects for 3D ICs\",\"authors\":\"A. More, B. Taskin\",\"doi\":\"10.1109/ISVLSI.2010.33\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A feasibility study of inter-tier wireless interconnects to be used in conjunction with through silicon vias (TSVs) for global communication in 3D ICs is presented. The feasibility is shown by performing a full wave electromagnetic analysis of on-chip communicating antennas in a 3D IC, modeled according to a fully-depleted silicon on insulator (FDSOI) 3D circuit integration technology. It is shown that the selected transmitting and receiving antennas provide a strong signal coupling at the adjacent (-6.67 dB) and the non-adjacent (-6.93 dB) tiers of the 3D IC at a radiation frequency of 10GHz. In addition to permitting non-adjacent tier communication, wireless interconnects are superior to TSVs in permitting non-vertically aligned connections between IC tiers.\",\"PeriodicalId\":187530,\"journal\":{\"name\":\"2010 IEEE Computer Society Annual Symposium on VLSI\",\"volume\":\"228 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-07-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Computer Society Annual Symposium on VLSI\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISVLSI.2010.33\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Computer Society Annual Symposium on VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISVLSI.2010.33","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation Based Feasibility Study of Wireless RF Interconnects for 3D ICs
A feasibility study of inter-tier wireless interconnects to be used in conjunction with through silicon vias (TSVs) for global communication in 3D ICs is presented. The feasibility is shown by performing a full wave electromagnetic analysis of on-chip communicating antennas in a 3D IC, modeled according to a fully-depleted silicon on insulator (FDSOI) 3D circuit integration technology. It is shown that the selected transmitting and receiving antennas provide a strong signal coupling at the adjacent (-6.67 dB) and the non-adjacent (-6.93 dB) tiers of the 3D IC at a radiation frequency of 10GHz. In addition to permitting non-adjacent tier communication, wireless interconnects are superior to TSVs in permitting non-vertically aligned connections between IC tiers.
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