Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium最新文献_第3页

Ba/sub x/Sr/sub 1-x/TiO/sub 3/ thin films made by Turbodisc/sup TM/ PE-MOCVD techniques 采用Turbodisc/sup TM/ PE-MOCVD技术制备Ba/sub x/Sr/sub 1-x/TiO/sub 3/薄膜

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559730

Tingkai Li, P. Zawadzki, R. Stall

引用次数: 0

The influence of pad geometry on ceramic ball grid array solder joint reliability 焊盘几何形状对陶瓷球栅阵列焊点可靠性的影响

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559742

S. Yee, H. Ladhar

引用次数: 4

Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps 倒装芯片附件采用各向异性导电胶粘剂和化学镍疙瘩

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559678

R. Aschenbrenner, A. Ostmann, G. Motulla, E. Zakel, H. Reichl

引用次数: 54

An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography 一种改进的用x射线层析成像和x射线微层析成像检查焊点的方法

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559785

A. Kalukin, V. Sankaran, B. Chartrand, D. Millard, R. Kraft, M. Embrechts

{"title":"An improved method for inspection of solder joints using X-ray laminography and X-ray microtomography","authors":"A. Kalukin, V. Sankaran, B. Chartrand, D. Millard, R. Kraft, M. Embrechts","doi":"10.1109/IEMT.1996.559785","DOIUrl":"https://doi.org/10.1109/IEMT.1996.559785","url":null,"abstract":"This paper describes the application of several imaging technologies available at the Center for solder joint inspection. X-ray laminography was combined with artificial neural networks to classify solder joints. Components with ball grid array, gull-wing and J-lead joints were imaged and several neural network methods were used to identify different classes of defects particularly significant to each type of joint. A novel probabilistic neural network approach for 2-D image classification has been developed which performs as well as or better than a conventional backpropagation network. The smear caused by the laminographic process poses a great challenge to accurate reconstruction and subsequent evaluation of the object. An improved method of accurately reconstructing the solder joint shape from the laminographic images has been developed as part of this research. The method removes artifacts caused by out-of-plane contributions, noise, and smear due to rotation of the source around the object while forming each laminograph, and can be adapted to consider the finite size of the aperture and X-ray scattering. Preliminary application of the method has produced dramatic improvements in the visual quality and signal-to-noise ratio for laminographs of experimental objects. More importantly, the ability to accurately measure the dimensions of the objects being imaged has been made possible by this approach. The possible extension of this work by using more X-ray projections and mathematically intensive routines brings this research into the realm of microtomography, which can help achieve more precise reconstruction at a much smaller scale. A new method of microtomography has been developed that can exceed previous limits in image resolution.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127786789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Intelligent process diagnosis based on end-of-line electrical test data 基于终端电气测试数据的智能过程诊断

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559754

R. Guo, C. Tsai, Jian-Huei Lee, Shi-Chung Chang

引用次数: 11

An overview of the Chinese electronics industry 中国电子工业概况

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559751

K. Tilley, D.J. Williams

引用次数: 1

Warpage and mechanical strength studies of ultra thin 150 mm wafers 超薄150mm晶圆的翘曲和机械强度研究

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559727

M. Grief, J. A. Steele

{"title":"Warpage and mechanical strength studies of ultra thin 150 mm wafers","authors":"M. Grief, J. A. Steele","doi":"10.1109/IEMT.1996.559727","DOIUrl":"https://doi.org/10.1109/IEMT.1996.559727","url":null,"abstract":"Demand for die produced on ultra thin silicon substrates requires improvement in wafer thinning capability, manufacturing equipment substrate handling and packing methodologies. Existing methods typically consider substrates that are nominally flat and relatively thick (254 /spl mu/m to 613 /spl mu/m). The challenge COM 1 faces on several of its product lines, is that they require that the 150 mm diameter substrate be thinned to below 150 /spl mu/m. Wafers at this thickness will tend to bow and warp with unpredictable orientation. This is due to the interaction between stresses from the various frontside and backside dielectric and conductive layers together with those induced by the backside grinding and chemical thinning and the reduced ability of the thin silicon substrate to resist these forces. Existing schemes used for smaller wafer diameters (<100 mm) have proven incapable of successfully thinning, handling and transferring these larger substrates to the assembly sites, resulting in high levels of wafer breakage. To enhance survivability during subsequent handling and shipment of ultra-thin 150 mm wafers, the understanding of warpage and die strength becomes critical, which is the focus of this paper.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133852065","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 19

High complexity PCB's for enhanced SMT and bare chip assembly applications 用于增强SMT和裸片组装应用的高复杂性PCB

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559718

S. Ehrler, R. Mayer, W. Olbrich, M. Roesch

引用次数: 2

Automatic classification of wafer defects: status and industry needs 晶圆缺陷自动分类:现状及行业需求

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559702

Arye Shapiro

引用次数: 10

Microsystems for medical applications 医疗用微系统

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI: 10.1109/IEMT.1996.559776

A. Val, D. Estève, C. Val

引用次数: 1