用于增强SMT和裸片组装应用的高复杂性PCB

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559718

S. Ehrler, R. Mayer, W. Olbrich, M. Roesch

{"title":"用于增强SMT和裸片组装应用的高复杂性PCB","authors":"S. Ehrler, R. Mayer, W. Olbrich, M. Roesch","doi":"10.1109/IEMT.1996.559718","DOIUrl":null,"url":null,"abstract":"New build-up technologies are necessary to meet the demands of future PC-boards. In this paper the DYCOstrate and PERL technologies are presented which use plasma etching for hole generation. These technologies offer advantages such as higher routing density, layer count reduction and lower production cost. Process flows are explained and possible constructions and design rules are presented. Electrical performance and reliability investigations have also been considered.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"High complexity PCB's for enhanced SMT and bare chip assembly applications\",\"authors\":\"S. Ehrler, R. Mayer, W. Olbrich, M. Roesch\",\"doi\":\"10.1109/IEMT.1996.559718\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New build-up technologies are necessary to meet the demands of future PC-boards. In this paper the DYCOstrate and PERL technologies are presented which use plasma etching for hole generation. These technologies offer advantages such as higher routing density, layer count reduction and lower production cost. Process flows are explained and possible constructions and design rules are presented. Electrical performance and reliability investigations have also been considered.\",\"PeriodicalId\":177653,\"journal\":{\"name\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1996.559718\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1996.559718","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

为了满足未来pc板的需求，需要新的组装技术。本文介绍了DYCOstrate和PERL两种等离子体蚀刻技术。这些技术具有更高的路由密度、减少层数和降低生产成本等优点。说明了工艺流程，并提出了可能的结构和设计规则。电气性能和可靠性调查也被考虑在内。

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High complexity PCB's for enhanced SMT and bare chip assembly applications

New build-up technologies are necessary to meet the demands of future PC-boards. In this paper the DYCOstrate and PERL technologies are presented which use plasma etching for hole generation. These technologies offer advantages such as higher routing density, layer count reduction and lower production cost. Process flows are explained and possible constructions and design rules are presented. Electrical performance and reliability investigations have also been considered.

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Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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