High complexity PCB's for enhanced SMT and bare chip assembly applications

Abstract

New build-up technologies are necessary to meet the demands of future PC-boards. In this paper the DYCOstrate and PERL technologies are presented which use plasma etching for hole generation. These technologies offer advantages such as higher routing density, layer count reduction and lower production cost. Process flows are explained and possible constructions and design rules are presented. Electrical performance and reliability investigations have also been considered.