焊盘几何形状对陶瓷球栅阵列焊点可靠性的影响

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559742

S. Yee, H. Ladhar

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引用次数: 4

摘要

与其他组合相比，采用热风调平(HASL)抛光的狗骨垫焊点的可靠性存在统计学差异，可靠性较低。其他组合的信度无显著差异。在本研究中评估的焊盘几何形状和表面光洁度都产生了优秀、可靠的焊点。焊盘几何形状和表面光洁度的选择不会对CBGA焊点的可靠性产生重大影响。由于该研究是基于机械挠度系统(MDS)测试技术，因此MDS的局限性将会存在。额外的加速热循环(ATC)测试来验证结论肯定是有价值的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The influence of pad geometry on ceramic ball grid array solder joint reliability

The reliability of the solder joints on dog bone pads with hot air solder levelling (HASL) finish was found to be statistically different and less reliable than other combinations. The reliability of all other combinations was not significantly different. Both pad geometries and surface finishes evaluated in this study produced excellent, reliable solder joints. The selection of the pad geometry and surface finish will not have significant impact on CBGA solder joint reliability. Since the study was based on mechanical deflection system (MDS) test technology, the limitations for MDS will apply. Additional accelerated thermal cycling (ATC) tests to verify the conclusion will definitely be of value.

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Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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