IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)最新文献_第6页

PRIME: passive realization of interconnect models from measured data PRIME:从测量数据中被动实现互连模型

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967608

J. Morsey, A. Cangellaris

引用次数: 58

Comparison between Chebyshev and power series expansion functions for interpolating data 插值数据的切比雪夫展开函数与幂级数展开函数的比较

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967634

S. Chakravorty, S. Min, M. Swaminathan

引用次数: 4

Analysis of multi-layered irregular power distribution planes with vias using transmission matrix method 用传输矩阵法分析带过孔的多层不规则配电平面

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967647

Joong-Ho Kim, M. Swaminathan

引用次数: 6

High sensitivity magnetic near field probe based on ferromagnetic thin-film technology 基于铁磁薄膜技术的高灵敏度近磁场探头

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967673

M. Yamaguchi, H. Kikuchi, S. Sugimoto, K. Arai, M. Iwanami, A. Nakamura, S. Hoshino

引用次数: 5

Development of planar antennas in multi-layer packages for RF-system-on-a-package applications 面向射频单包系统应用的多层封装平面天线的研制

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967621

K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, R. Tummala

引用次数: 29

Analysis of transmission line structures using a dynamic analysis through WIPL-D 利用WIPL-D对输电线路结构进行动态分析

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967610

J. Stamm, T. Sarkar, B. Kolundžija, M. Salazar-Palma

{"title":"Analysis of transmission line structures using a dynamic analysis through WIPL-D","authors":"J. Stamm, T. Sarkar, B. Kolundžija, M. Salazar-Palma","doi":"10.1109/EPEP.2001.967610","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967610","url":null,"abstract":"In packaging systems it is necessary to compute radiation from printed circuits. Analysis of radiation from printed circuits is quite difficult because the codes that are generally used for far fast efficient calculation of transients on these systems due to different loads are often not capable of analyzing radiation. On the other hand, dynamic solutions that calculate radiation from printed circuits often require large computational resources as it needs to calculate the electric fields from structures that are very closely spaced and thus require significant computational accuracy. What we show is that using entire domain basis one can provide accurate dynamic solutions for transmission like structures. Because in this expansion one uses an entire domain basis, the charge along the structure is continuous and therefore provides accurate values of the near fields. Typically in using an entire domain basis one can reduce the size of the matrix on large structures typically by a factor of ten. Hence large packaging problems can be solved using modest computational resources quite efficiently. Numerical results are presented to illustrate these principles.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129604670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Model extraction and waveform correlation via a generalized frequency- and time-domain optimizer 基于广义频域和时域优化器的模型提取和波形关联

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967631

Ling Yang, Ching-Chao Huang, J. Feng

引用次数: 1

The use of loop inductances in signal integrity modeling 环路电感在信号完整性建模中的应用

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967616

M. Tsuk

引用次数: 4

Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane 功率/地平面FDTD高效建模的等效电路表示与降维技术

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967632

Heeseok Lee, Hyungsoo Kim, Jingook Kim, Y. Jeong, Joungho Kim

引用次数: 3

Modelling of multi-layered power supply planes with vias 带过孔的多层供电平面的建模

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967613

Shih-Yen Lee, Y. Yeo, M. Yeo, M. Iyer, N. Do, Wui-Weng Wong

引用次数: 5