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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)最新文献

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Simulations of frequency dependencies of delta-I noise i噪声的频率依赖性模拟
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967645
B. Garden, R. Frech, J. Supper
{"title":"Simulations of frequency dependencies of delta-I noise","authors":"B. Garden, R. Frech, J. Supper","doi":"10.1109/EPEP.2001.967645","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967645","url":null,"abstract":"In this paper frequency dependencies of delta-I noise caused by variations in on-chip switching activity has been studied for a complex computer system board with multi-chip module, especially the impact of coincidences with resonances of the power distribution system. The switching cycle has been varied in case of a single delta-I step and the effect of repeated delta-I steps and variations of the delta-I repetition frequency and the duty factor have been analyzed.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"274 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124425602","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Powering Intel(R) Pentium(R) 4 generation processors 为Intel(R) Pentium(R) 4代处理器供电
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967649
M.T. Zhang
{"title":"Powering Intel(R) Pentium(R) 4 generation processors","authors":"M.T. Zhang","doi":"10.1109/EPEP.2001.967649","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967649","url":null,"abstract":"Power delivery design methodology of Intel(R) Pentium(R) 4 processors is presented, including loadline specification, voltage regulator design, and decoupling on motherboard and package. The results of simulation analyses are verified with measured data.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121054568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Characterization of on-chip capacitance effects for I/O circuits and core circuits 片上电容对I/O电路和核心电路的影响
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967614
T. Sudo, K. Nakano, J. Kudo, S. Haga
{"title":"Characterization of on-chip capacitance effects for I/O circuits and core circuits","authors":"T. Sudo, K. Nakano, J. Kudo, S. Haga","doi":"10.1109/EPEP.2001.967614","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967614","url":null,"abstract":"This paper presents experimental results for two types of CMOS VLSI test chips that were with and without on-chip capacitance. Radiated emission and simultaneous switching were characterized by activating I/O circuits or core logic circuits.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125355095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Fast electromagnetic modeling for electronic packaging in layered media 层状介质中电子封装的快速电磁建模
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967641
X. Xu, Q. Liu
{"title":"Fast electromagnetic modeling for electronic packaging in layered media","authors":"X. Xu, Q. Liu","doi":"10.1109/EPEP.2001.967641","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967641","url":null,"abstract":"A fast numerical method, the stabilized biconjugate gradient fast Fourier transform method (BCGS-FFT), is applied to solve the electric field integral equation (EFIE). The EFIE characterizes the electromagnetic behavior of printed conductors in a planarly layered medium. This method is applied to characterize high-speed electronic packages.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126639505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes 三维互连结构和任意形状集成无源的广义PEEC模型
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967651
A. Rong, A. Cangellaris
{"title":"Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes","authors":"A. Rong, A. Cangellaris","doi":"10.1109/EPEP.2001.967651","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967651","url":null,"abstract":"This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"235 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115244224","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 36
Reduced-order models based on measured S-parameters for time-frequency analysis of microwave circuits using genetic algorithms 基于测量s参数的微波电路时频分析降阶模型
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967639
J.M. Gomez, B. Gómez, M. Ruipérez, J. Alonso
{"title":"Reduced-order models based on measured S-parameters for time-frequency analysis of microwave circuits using genetic algorithms","authors":"J.M. Gomez, B. Gómez, M. Ruipérez, J. Alonso","doi":"10.1109/EPEP.2001.967639","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967639","url":null,"abstract":"An efficient technique is developed to characterize the time-frequency domain behavior of microwave and RF devices characterized by its S-parameters, by means of the implementation of reduced-order models, expressed in terms of rational polynomials, into a general time domain simulator. The use of a genetics algorithm guarantees the smallest model order.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123030084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Crosstalk for curvilinear conductors by utilising a nonuniform transmission line approach 利用非均匀传输线方法的曲线导体串扰
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967643
Chunfei Ye, Erping Li, Gan Yiin Shenn
{"title":"Crosstalk for curvilinear conductors by utilising a nonuniform transmission line approach","authors":"Chunfei Ye, Erping Li, Gan Yiin Shenn","doi":"10.1109/EPEP.2001.967643","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967643","url":null,"abstract":"A novel approach to derive nonuniform transmission line equations for curvilinear multiconductor systems by using scalar and vector potentials associated with boundary conditions is presented. Crosstalk of bent conductors with different radii is investigated.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116745491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Efficient construction of two-port passive macromodels for resonant networks 共振网络双端口无源宏模型的高效构建
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967652
S. Min, Madhavan Swaminathan
{"title":"Efficient construction of two-port passive macromodels for resonant networks","authors":"S. Min, Madhavan Swaminathan","doi":"10.1109/EPEP.2001.967652","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967652","url":null,"abstract":"This paper discusses an efficient method for the construction of two-port macromodels by ensuring the stability and passivity of the circuit. The macromodels are based on rational functions that are generated by solving an eigenvalue problem. The passivity is enforced through constraints on the residue of the rational function. This method was applied on simulation and measured data and found to give good results.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126206970","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 34
Modeling of interconnects and electromagnetic field distributions using FDTD method 用时域有限差分法对互连和电磁场分布进行建模
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967638
T. Watanabe, M. Suzuki, A. Kamo, H. Asai
{"title":"Modeling of interconnects and electromagnetic field distributions using FDTD method","authors":"T. Watanabe, M. Suzuki, A. Kamo, H. Asai","doi":"10.1109/EPEP.2001.967638","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967638","url":null,"abstract":"Describes an efficient technique for synthesizing macromodels of interconnects and electromagnetic emissions on a PCB. This technique enables one to rapidly extract the characteristics of interconnects using FDTD method and its Absolute Boundary Conditions. Once making the macromodels, electromagnetic distributions are rapidly analyzed by conventional circuit simulators.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127906525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modelling complex via hole structures 模拟复杂的孔洞结构
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI: 10.1109/EPEP.2001.967633
E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion
{"title":"Modelling complex via hole structures","authors":"E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, D. Morlion","doi":"10.1109/EPEP.2001.967633","DOIUrl":"https://doi.org/10.1109/EPEP.2001.967633","url":null,"abstract":"We derive a physics based circuit model for complex via hole structures on PCBs. Capacitances are computed using a three-dimensional electrostatic solver and inductances using a two-dimensional quasi-TEM solver (Olyslager et al, IEEE Trans. Microwave Theory Tech., vol. 39, no. 6, pp. 901-909, 1991).","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132601073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 55
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