{"title":"用时域有限差分法对互连和电磁场分布进行建模","authors":"T. Watanabe, M. Suzuki, A. Kamo, H. Asai","doi":"10.1109/EPEP.2001.967638","DOIUrl":null,"url":null,"abstract":"Describes an efficient technique for synthesizing macromodels of interconnects and electromagnetic emissions on a PCB. This technique enables one to rapidly extract the characteristics of interconnects using FDTD method and its Absolute Boundary Conditions. Once making the macromodels, electromagnetic distributions are rapidly analyzed by conventional circuit simulators.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling of interconnects and electromagnetic field distributions using FDTD method\",\"authors\":\"T. Watanabe, M. Suzuki, A. Kamo, H. Asai\",\"doi\":\"10.1109/EPEP.2001.967638\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Describes an efficient technique for synthesizing macromodels of interconnects and electromagnetic emissions on a PCB. This technique enables one to rapidly extract the characteristics of interconnects using FDTD method and its Absolute Boundary Conditions. Once making the macromodels, electromagnetic distributions are rapidly analyzed by conventional circuit simulators.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"63 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967638\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967638","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling of interconnects and electromagnetic field distributions using FDTD method
Describes an efficient technique for synthesizing macromodels of interconnects and electromagnetic emissions on a PCB. This technique enables one to rapidly extract the characteristics of interconnects using FDTD method and its Absolute Boundary Conditions. Once making the macromodels, electromagnetic distributions are rapidly analyzed by conventional circuit simulators.