{"title":"为Intel(R) Pentium(R) 4代处理器供电","authors":"M.T. Zhang","doi":"10.1109/EPEP.2001.967649","DOIUrl":null,"url":null,"abstract":"Power delivery design methodology of Intel(R) Pentium(R) 4 processors is presented, including loadline specification, voltage regulator design, and decoupling on motherboard and package. The results of simulation analyses are verified with measured data.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":"{\"title\":\"Powering Intel(R) Pentium(R) 4 generation processors\",\"authors\":\"M.T. Zhang\",\"doi\":\"10.1109/EPEP.2001.967649\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power delivery design methodology of Intel(R) Pentium(R) 4 processors is presented, including loadline specification, voltage regulator design, and decoupling on motherboard and package. The results of simulation analyses are verified with measured data.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"17\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967649\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967649","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power delivery design methodology of Intel(R) Pentium(R) 4 processors is presented, including loadline specification, voltage regulator design, and decoupling on motherboard and package. The results of simulation analyses are verified with measured data.