2012 2nd IEEE CPMT Symposium Japan最新文献_第10页

Wireless body area communication using electromagnetic resonance coupling 利用电磁共振耦合的无线体域通信

2012 2nd IEEE CPMT Symposium Japan Pub Date : 2012-12-01 DOI: 10.1109/ICSJ.2012.6523439

F. Koshiji, N. Yuyama, K. Koshiji

引用次数: 11

Productivity improvement of copper pillar flip-chip package by pre-applied materials and press machine 采用预敷材料和压片机提高铜柱倒装封装的生产率

2012 2nd IEEE CPMT Symposium Japan Pub Date : 2012-12-01 DOI: 10.1109/ICSJ.2012.6523392

K. Motomura, H. Maruo, Wanyu Tie, H. Eifuku, S. Sakemi, T. Sakai

引用次数: 2

Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration 用于3D集成的临时键合/脱键和永久晶圆键合解决方案

2012 2nd IEEE CPMT Symposium Japan Pub Date : 2012-12-01 DOI: 10.1109/ICSJ.2012.6523416

H. Ishida, S. Sood, C. Rosenthal, S. Lutter

引用次数: 5

Novel technology for power integrity using a metal particle conductive layer 利用金属颗粒导电层实现电源完整性的新技术

2012 2nd IEEE CPMT Symposium Japan Pub Date : 2012-12-01 DOI: 10.1109/ICSJ.2012.6523445

Noifumi Sasaoka, Takafumi Ochi, M. Oono, C. Ueda, Y. Akiyama, K. Otsuka, Nippon Kodoshi Corporation, Haruno-Cho Hirooka-Kami

{"title":"Novel technology for power integrity using a metal particle conductive layer","authors":"Noifumi Sasaoka, Takafumi Ochi, M. Oono, C. Ueda, Y. Akiyama, K. Otsuka, Nippon Kodoshi Corporation, Haruno-Cho Hirooka-Kami","doi":"10.1109/ICSJ.2012.6523445","DOIUrl":"https://doi.org/10.1109/ICSJ.2012.6523445","url":null,"abstract":"Power integrity (PI) for recent electronics circuits and systems is the most important technological issue in the field and has been addressed in important papers through several approaches[1][2]. A novel technology is used in our study only using a conductive layer of dispersed metal particles instead of copper plane. We investigate physical phenomena and some fundamental data for PI. The transmission lines which uses metal particle conductive layer(MPCL), it causes the change in a variety of electromagnetic wave transmission speeds such as increases 76% and decrease by 21%. As a result, Z11 value of power/GND plane test coupon at 5GHz is from 2.01 (ICEP2011 [3]) to 1.79 ohm. Also we made a trial PCB in which we only replaced from the power copper metal plane in the circuit board with MPCL. The voltage fluctuation was decreased about 60% using a MPCL structure. Our developed MPCL structure has excellent characteristics not only for PI but also SI in the desirable high-frequency region. This phenomenon must be clarified as the physical basis for more progressive PI and SI issues. We suppose that these characteristic is due to interactions between electromagnetic wave and metal surface electrons. So we think that the morphology of MPCL must be an important point of improving PI and SI in the desirable high frequency region.","PeriodicalId":174050,"journal":{"name":"2012 2nd IEEE CPMT Symposium Japan","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121623746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Board level drop test modeling 板级跌落测试建模

2012 2nd IEEE CPMT Symposium Japan Pub Date : 1900-01-01 DOI: 10.1109/icsj.2012.6523419

M. Amagai, J. Seungmin

引用次数: 0