Productivity improvement of copper pillar flip-chip package by pre-applied materials and press machine

Abstract

In this report, authors describe improvement effort of fine pitch flip-chip interconnection based on pre-applied material process. For evaluation, IC with copper pillar bumps (50 μm pitch) and organic boards (FR-5) have been used. NCF and B-stage material have been used as pre-applied connecting material. As a result, we have developed temporary alignment and subsequent batch bonding process to improve productivity.