采用预敷材料和压片机提高铜柱倒装封装的生产率

2012 2nd IEEE CPMT Symposium Japan Pub Date : 2012-12-01 DOI:10.1109/ICSJ.2012.6523392

K. Motomura, H. Maruo, Wanyu Tie, H. Eifuku, S. Sakemi, T. Sakai

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引用次数: 2

摘要

本文介绍了基于预应用材料工艺的小间距倒装芯片互连的改进工作。为了进行评估，使用了铜柱凸点(50 μm间距)和有机板(FR-5)的IC。采用NCF和b级材料作为预涂连接材料。因此，我们开发了临时对准和随后的批量粘合工艺，以提高生产率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Productivity improvement of copper pillar flip-chip package by pre-applied materials and press machine

In this report, authors describe improvement effort of fine pitch flip-chip interconnection based on pre-applied material process. For evaluation, IC with copper pillar bumps (50 μm pitch) and organic boards (FR-5) have been used. NCF and B-stage material have been used as pre-applied connecting material. As a result, we have developed temporary alignment and subsequent batch bonding process to improve productivity.

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2012 2nd IEEE CPMT Symposium Japan

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