{"title":"用于3D集成的临时键合/脱键和永久晶圆键合解决方案","authors":"H. Ishida, S. Sood, C. Rosenthal, S. Lutter","doi":"10.1109/ICSJ.2012.6523416","DOIUrl":null,"url":null,"abstract":"Thin wafer handling (or temporary bonding/de-bonding) and permanent wafer bonding are two of the key enabling technologies for 3D-IC integration process. Temporary bonding adhesive in conjunction with de-bonding method has to be carefully selected to obtain damage-free thinned processed wafers. Room temperature mechanical lift-off de-bonding method with proper de-bond wave front control is considered to be promising. Metal-adhesive or metal-oxide hybrid bonding can create a final stacked 3D-IC structure with superior mechanical strength, electrical performance and excellent post-bond alignment.","PeriodicalId":174050,"journal":{"name":"2012 2nd IEEE CPMT Symposium Japan","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration\",\"authors\":\"H. Ishida, S. Sood, C. Rosenthal, S. Lutter\",\"doi\":\"10.1109/ICSJ.2012.6523416\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thin wafer handling (or temporary bonding/de-bonding) and permanent wafer bonding are two of the key enabling technologies for 3D-IC integration process. Temporary bonding adhesive in conjunction with de-bonding method has to be carefully selected to obtain damage-free thinned processed wafers. Room temperature mechanical lift-off de-bonding method with proper de-bond wave front control is considered to be promising. Metal-adhesive or metal-oxide hybrid bonding can create a final stacked 3D-IC structure with superior mechanical strength, electrical performance and excellent post-bond alignment.\",\"PeriodicalId\":174050,\"journal\":{\"name\":\"2012 2nd IEEE CPMT Symposium Japan\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 2nd IEEE CPMT Symposium Japan\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSJ.2012.6523416\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 2nd IEEE CPMT Symposium Japan","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2012.6523416","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temporary bonding/de-bonding and permanent wafer bonding solutions for 3D integration
Thin wafer handling (or temporary bonding/de-bonding) and permanent wafer bonding are two of the key enabling technologies for 3D-IC integration process. Temporary bonding adhesive in conjunction with de-bonding method has to be carefully selected to obtain damage-free thinned processed wafers. Room temperature mechanical lift-off de-bonding method with proper de-bond wave front control is considered to be promising. Metal-adhesive or metal-oxide hybrid bonding can create a final stacked 3D-IC structure with superior mechanical strength, electrical performance and excellent post-bond alignment.
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