Board level drop test modeling

Abstract

Recently, drop test reliability has become a major concern for mobile electronic products. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased stress in solder joints during drop impacts due to their complicate structures. In this study, evaluations of test board material properties, damping parameters, the correlation of displacements and strains between model and drop test and also parameters of fail cyclic life prediction were performed with three point bend tests, acceleration sensors, strain gauges, a high speed camera, drop testers, dynamic finite element models.