2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)最新文献

Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers 纳米和微氧化镁填料改善环氧树脂复合材料的高温介电性能

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-05-31 DOI: 10.1109/IWIPP.2017.7936745

Q. Xie, Y. Ohki, N. Hirai, Y.H. Cheng

{"title":"Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers","authors":"Q. Xie, Y. Ohki, N. Hirai, Y.H. Cheng","doi":"10.1109/IWIPP.2017.7936745","DOIUrl":"https://doi.org/10.1109/IWIPP.2017.7936745","url":null,"abstract":"Nano-sized magnesium oxide or magnesia has been reported to be useful for suppressing the space charge accumulation when it is added in epoxy resin. However, the addition of nano-magnesia to epoxy resin decreases the glass transition temperature (Tg) signficantly, which may limit industrial applications of magnesia/epoxy nanocomposites. In this work, nanomagnesia particles with an average size of 52 nm and micro-magnesia with an average size of 3.1 pm were mixed in a commercially available bisphenol-A epoxy resin. The weight ratio of nano- and micro-fillers in each composite was changed, while the total content of the two fillers was fixed at 5 weight%. As a result, it has become clear that the addition of micro-sized magnesia fillers to magnesia/epoxy nanocomposites recovers Tg back to its original high temperature. Then, a dc electric field of 30 kV/mm was applied to the samples for 20 minutes at various temperatures from 40 to 200 °C and space charge distributions were measured by the pulsed electro-acoustic method. The results show that space charge accumulates in both vicinities of the cathode and the anode with the same polarities as those of the nearby electrodes when the temperature is 80 °C or below. However, space charges become hetero and are observed only in the vicinity of the cathode at 140 °C and above. These homocharges and heterocharges become very small when the weight content of nano-sized fillers increases, which is industrially very important. Both complex dielectric permittivity and electrical conductivity also decrease with the increase in the content of nanofillers.","PeriodicalId":164552,"journal":{"name":"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)","volume":"143 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123438450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced double sided cooling IGBT module and power control unit development 先进的双面冷却IGBT模块和电源控制单元的开发

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-05 DOI: 10.1109/IWIPP.2017.7936750

Shiwu Zhu, Yun Li, Yangang Wang, Yaqing Ma, Chundong Wu, Mingliang Jiao, Zhenlong Zhao, Jun Yu

引用次数: 8

High frequency high voltage generation with air-core transformer 采用空芯变压器高频高压发电

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-05 DOI: 10.1109/IWIPP.2017.7936761

Saijun Mao, Chengmin Li, Tingting Song, J. Popovic, J. Ferreira

{"title":"High frequency high voltage generation with air-core transformer","authors":"Saijun Mao, Chengmin Li, Tingting Song, J. Popovic, J. Ferreira","doi":"10.1109/IWIPP.2017.7936761","DOIUrl":"https://doi.org/10.1109/IWIPP.2017.7936761","url":null,"abstract":"A novel high frequency high voltage (HV) generator circuit with air-core transformer is proposed in this paper to achieve high power density packaging structure and compact size advantages. Planar multi-layer printed circuit board(PCB) winding and litz wire wound winding structure are investigated for air-core HV transformer. The electrical design of air-core HV transformer with HV multiplier circuit based on 1.2kV SiC Schottky diode are introduced. A with 450 kHz switching frequency HV generator prototype with 310W output power and 1kV output voltage is built in lab. The litz wire air-core HV transformer prototype is built to compare the efficiency, thermal performance and size with planar air-core HV transformer. The planar PCB air-core transformer based on HV generator can achieve 80.5% efficiency and 1.09kW/L power density. The litz wire wounded transformer based HV generator provide 89.0% efficiency and around 0.53kW/L power density. The design with planar PCB air-core transformer enable high voltage generation circuit system compact planar packaging. The design with litz wire air-core HV transformer behaves higher efficiency and thermal performance with low high frequency AC winding loss.","PeriodicalId":164552,"journal":{"name":"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116827816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Suppression of electromagnetic interference using screening and shielding techniques within the switching cells 在开关单元内使用筛选和屏蔽技术抑制电磁干扰

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-05 DOI: 10.1109/IWIPP.2017.7936762

Zhe Zhang, C. Mark Johnson

引用次数: 2

Design and construction of a co-planar power bus interconnect for low inductance switching 一种用于低电感开关的共面功率母线互连的设计与构造

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-05 DOI: 10.1109/IWIPP.2017.7936755

Xi Lin, Jianfeng Li, Mark C. Johnson

引用次数: 3

Thermal improvement of press-pack packages: Pressure dependent thermal contact resistance with a thin silver interlayer between molybdenum substrate and silicon carbide chip 压包封装的热改进:在钼衬底和碳化硅芯片之间有薄银夹层的压力依赖热接触电阻

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-01 DOI: 10.1109/IWIPP.2017.7936753

Z. Toth-Pal, Yafan Zhang, T. Hammam, H. Nee, M. Bakowski

引用次数: 1

Reducing thermal coupling using fluid cooled low-k interposers 使用流体冷却的低k介电剂减少热耦合

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-01 DOI: 10.1109/IWIPP.2017.7936769

M. Fish, P. McCluskey, A. Bar-Cohen

引用次数: 2

Analysis of quasi-Z source PFC convertor and its comparison with traditional flyback 准z源PFC变换器的分析及其与传统反激式变换器的比较

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-01 DOI: 10.1109/IWIPP.2017.7936758

Fahad M. Alhuwaishel, SinanAl-Obaidi, N. Ahmed

{"title":"Analysis of quasi-Z source PFC convertor and its comparison with traditional flyback","authors":"Fahad M. Alhuwaishel, SinanAl-Obaidi, N. Ahmed","doi":"10.1109/IWIPP.2017.7936758","DOIUrl":"https://doi.org/10.1109/IWIPP.2017.7936758","url":null,"abstract":"The quasi Z-source power factor correction (QZS-PFC) in the range of 36–720W is analyzed for continuous conduction mode operation and compared with a classical flyback power factor correction (F-PFC) under the same operation conditions. A very precise closed loop duty ratio control was developed to optimize the performance of the QZS-PFC. The selected topology of QZS-PFC is compared with traditional F-PFC operating in continuous conduction mode (CCM) and the study confirms that it operates better than the F-PFC at different power ratings. The major advantage of QZS-PFC is its high performance, and ability to accommodate higher load than the traditional F-PFC. The total harmonic distortion (THD) for the QZS-PFC was considerably low when load were increasing; the value for the THD% reached the standardized limits of 5% while operation at load of 360 W and above. Moreover, the power factor value is close to one across the range of operation with minimal voltage and current ripple. It was confirmed that the main elements of QZS-PFC has lower current and voltage stress due to the effect of crossed capacitors. In contrast, F-PFC suffers from high voltage spikes and requires a snubber circuit. Considering the obtained results, the QZS-PFC has a better operation range which makes it an interesting topology to be widely explored.","PeriodicalId":164552,"journal":{"name":"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116281881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ 粘塑性无铅焊料寿命预测:一种新型焊料SACQ

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-01 DOI: 10.1109/IWIPP.2017.7936754

Tung Ching Lui

引用次数: 5

Investigation of prototype SiC power module structure for low inductance and high heat operation 低电感高热工作SiC功率模块原型结构研究

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) Pub Date : 2017-04-01 DOI: 10.1109/IWIPP.2017.7936767

Akihiro Imakiire, Keigo Nakamura, H. Tanabe, Hikaru Kaisyakuji, Tomohiro Kubo, M. Kozako, M. Hikita

引用次数: 0