Reducing thermal coupling using fluid cooled low-k interposers

Abstract

The thermal isolation capabilities of fluid cooled via-enhanced glass interposers are investigated with resistive-heater test chips and IR thermography. Previous studies have shown that the degree of thermal coupling between adjacent devices hosted on via-enhanced low conductivity interposers is lower than those on silicon interposers, but at the cost of increased chip-to-ambient thermal resistance. By integrating the enhanced low-k interposer with an embedded microgap cooler, much higher chip power can be dissipated while maintaining an acceptable temperature rise.