{"title":"粘塑性无铅焊料寿命预测:一种新型焊料SACQ","authors":"Tung Ching Lui","doi":"10.1109/IWIPP.2017.7936754","DOIUrl":null,"url":null,"abstract":"The wafer level chip scale package (WLCSP) offers small form factor and high performance solution. Lately, a novel solder material, SACQ (92.443Sn4.0Ag0.5Cu8.0Bi0.05Ni 0.007Ge), is developed and applied on the WLCSP products but there is not much information and research in the nowadays market regarding the reliability of solder joints. This paper, lead-free solder constitutive laws of Anand's viscoplasticity model is utilized in the finite element method (FEM) calculation. The fatigue parameters of SACQ are presented and used to predict the characterized life cycle.","PeriodicalId":164552,"journal":{"name":"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ\",\"authors\":\"Tung Ching Lui\",\"doi\":\"10.1109/IWIPP.2017.7936754\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The wafer level chip scale package (WLCSP) offers small form factor and high performance solution. Lately, a novel solder material, SACQ (92.443Sn4.0Ag0.5Cu8.0Bi0.05Ni 0.007Ge), is developed and applied on the WLCSP products but there is not much information and research in the nowadays market regarding the reliability of solder joints. This paper, lead-free solder constitutive laws of Anand's viscoplasticity model is utilized in the finite element method (FEM) calculation. The fatigue parameters of SACQ are presented and used to predict the characterized life cycle.\",\"PeriodicalId\":164552,\"journal\":{\"name\":\"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)\",\"volume\":\"108 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWIPP.2017.7936754\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWIPP.2017.7936754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
摘要
晶圆级芯片规模封装(WLCSP)提供小尺寸和高性能的解决方案。最近，一种新的焊料SACQ (92.443 sn4.0 ag0.5 cu0.8 bi0.05 ni 0.007Ge)被开发并应用于WLCSP产品，但目前市场上关于焊点可靠性的信息和研究并不多。本文将Anand粘塑性模型的无铅焊料本构规律应用于有限元计算中。提出了SACQ的疲劳参数，并将其用于预测表征寿命周期。
Lifetime prediction of viscoplastic lead-free solder: A new solder material, SACQ
The wafer level chip scale package (WLCSP) offers small form factor and high performance solution. Lately, a novel solder material, SACQ (92.443Sn4.0Ag0.5Cu8.0Bi0.05Ni 0.007Ge), is developed and applied on the WLCSP products but there is not much information and research in the nowadays market regarding the reliability of solder joints. This paper, lead-free solder constitutive laws of Anand's viscoplasticity model is utilized in the finite element method (FEM) calculation. The fatigue parameters of SACQ are presented and used to predict the characterized life cycle.
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