2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)最新文献_第7页

Optimizing the cleaning process through cleaning efficiency examination 通过清洗效率检查优化清洗流程

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507814

V. Sítko, M. Saffer, I. Szendiuch, M. Bursik

引用次数: 1

High power multi-chip system integration in package 高功率多芯片系统集成封装

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507871

H. Wieser, S. Wei, A. Kolbeck

引用次数: 0

The effect of STI and active length on dual gate oxide reliability STI和有效长度对双栅氧化物可靠性的影响

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507827

N. H. Seng

引用次数: 0

Nanowire conductance biosensor by spacer patterning lithography technique for DNA hybridization detection: Design and fabrication method 用于DNA杂交检测的间隔图光刻纳米线导生物传感器:设计与制造方法

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507831

U. Hashim, S. Salleh, Emi Azri Shohini, Siti Fatimah Abd Rahman

引用次数: 7

High speed wafer dicing with ablation laser cut 采用烧蚀激光切割的高速圆片切割

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507855

David Wong Chee Way, L. Ying

引用次数: 2

An experimental study on the application of Carbon nanotubes (CNTs) as thermal interfacial material in processor chip testing 碳纳米管作为热界面材料在处理器芯片测试中的应用实验研究

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507874

Lee Yuan Thing, D. Mutharasu

引用次数: 0

Process development of fast-cure low stress lid adhesive for microprocessors 微处理器用快固化低应力盖胶的工艺开发

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507786

K. Keok, S. Too, J. Diep, Quah Hong Tat, A. Fumihiro, Kim Le

{"title":"Process development of fast-cure low stress lid adhesive for microprocessors","authors":"K. Keok, S. Too, J. Diep, Quah Hong Tat, A. Fumihiro, Kim Le","doi":"10.1109/IEMT.2008.5507786","DOIUrl":"https://doi.org/10.1109/IEMT.2008.5507786","url":null,"abstract":"A lid or heat spreader is used for packaging microprocessor chips. There are two primary functions for the lid: dissipate heat efficiently from the microprocessor and provide physical protection to the fragile silicon chip. To achieve these functions, lid material, thermal interface material and adhesive material, and assembly process are key areas that require development. Lid adhesive has a critical role in ensuring the whole microprocessor package meets thermal and thermomechanical reliability requirements. Lid adhesive has to provide good and consistent bonding strength between the lid and the substrate under various application conditions. At the same time, it also needs to absorb the stresses in the microprocessor package due to thermal mismatch between various materials: silicon, underfill, organic substrate, and lid. Another less known function of lid and adhesive is package warpage reduction. This paper discusses a low-stress lid adhesive material development that features a wide material processing window and fast-cure capability to improve assembly process throughput. Key material characteristics, including bonding strength, fracture mode, package warpage and reliability performance data will be presented to demonstrate the capability of the material to meet performance and reliability requirements for microprocessor packages.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122987992","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump 采用新颖的非清洁焊剂回流轮廓，提高焊剂稳定性和氧化层去除高铅焊料凸点

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507833

N. Amin, A. Y. Cheah, Lam Zi Yi, Z. Kornain

引用次数: 3

Breakthrough of laser deflash system to improve productivity 突破激光消闪系统，提高生产效率

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507858

Deng Bin, Shao Peng, Wang Yue

{"title":"Breakthrough of laser deflash system to improve productivity","authors":"Deng Bin, Shao Peng, Wang Yue","doi":"10.1109/IEMT.2008.5507858","DOIUrl":"https://doi.org/10.1109/IEMT.2008.5507858","url":null,"abstract":"This paper describes a new build-in-vision (BIV) and vertical laser cutting method to improve capacity of laser deflash system with maintaining 3 mils lead flash remains in miniature package such as SOD923. This equipment is developed by Leshan-Phoenix Semiconductor Co. Ltd. (LPS) and supplier. The traditional laser deflash system is equipped with pre-vision for package positioning, post-vision for lead frame positioning and laser cutting per transferred data from vision system. In order to avoid more than 3 mils tiny lead mold flash which was induced by blocking or shading laser beam couple with units that locating at far end from laser center focus point. Therefore, lead frame was subjected to “Three Indexes” using slantwise cutting concept. However, it takes longer cycle time and becomes bottleneck. The new laser deflash system is equipped with new designed build-in-vision and special telecentric laser beam focus system. Build-in-vision is consists of vision camera, lighting and special designed coupling mirror which is capable of penetrating through both vision lighting and laser beam. This design assures vision positioning inspection and laser cutting simultaneously. A special tele-centric lens was designed to change the angle of laser beam for controlling the reflection of laser beam away from focus-centre point. This is to ensure laser beam vertically in the whole laser cutting field. The new system has the capability with build-in-vision and vertical laser cutting design shows significant improvement on mechanical transfer time and laser cutting time.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128469524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Building a Delamination-free Electronic Package Using Thermal Analysis Data 利用热分析数据构建无分层电子封装

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI: 10.1109/IEMT.2008.5507861

S. Dal

{"title":"Building a Delamination-free Electronic Package Using Thermal Analysis Data","authors":"S. Dal","doi":"10.1109/IEMT.2008.5507861","DOIUrl":"https://doi.org/10.1109/IEMT.2008.5507861","url":null,"abstract":"Package delamination is a product of chemical, mechanical and thermal incompatibilities. Thermal analysis methods are used to study these factors along with other techniques. One thermomechanical analysis (TMA) data that can be maximized in order to get a delamination-free combination of materials is the glass transition temperature (Tg) measurement. The thermograph produced contains information on Tg, coefficient of thermal expansion (CTE) and total expansion (dimension change). The technique shown in this paper is to combine different Tg thermographs of adhesives, encapsulants and metal parts in order to create a “package”. To keep the unit from “delaminating”, the thermographs have to be as uniform as possible when overlayed. At the very least, the graphs should be able to show which interfaces are at risk of delamination during certain assembly processes. The same concept is used if one intends to improve an existing process condition. Thermographs of copper leadframe (Cu LF), die attach (DA) adhesive and epoxy mold compound (EMC) samples are generated using cure profiles (for the polymers only) and a standard heating rate of 10°C/min. The resulting thermographs are overlayed and the best combination is chosen by visual comparison. The beauty of the technique is that it is simple, rich in technical basis and individual results can be easily stored in a database.","PeriodicalId":151085,"journal":{"name":"2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127021213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0