High power multi-chip system integration in package

Abstract

This paper presents a new high power package for automotive products. It provides innovative interconnecting concepts for multi-die integration of different semiconductor technologies in a single package with automotive grade reliability. Cost effective thermal performance and current carrying capabilities are improved compared to standard packaging methods. A description of key manufacturing process steps, the resulting package integrity, device performance and reliability will be given during the IEMT conference. Special focus will be on the optimization of the process with mold flow simulations and encapsulation experiments with a split flag design. Applied design and process development methodologies will be demonstrated for an automotive high power dual chip application. Experimental characterization will comprise thermal and electrical performance measurements and environmental stress tests.