Optimizing the cleaning process through cleaning efficiency examination

Abstract

The paper explores the efficiency of cleaning methods in order to select a method and optimize cleaning as a part of assembly manufacturing process in microelectronics. To find out the advantages and potentialities of each single cleaning method it is necessary to use simple but reliable evaluation method. In this paper are under consideration two different methods for contamination evaluation, the first being the standard one using the contaminometer, and the second, new one, which is developed on an optical principle. The new method for cleaning evaluation is based on measuring the contamination in special substrate pattern using a scanning unit (programmable automated optical inspection). The special pattern was designed and realized on a glass substrate with ceramic chip models. The experimental part presents the efficiency examination and compares ultrasonic cleaning in microemulsion to other methods like spray in the air etc. The results of this study are used in optimizing and adjusting cleaning equipments as well as in their improvement and innovation.