Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)最新文献_第4页

Spin-on dielectric stack low-k integration with EB curing technology for 45nm-node and beyond 45纳米及以上节点的自旋介电堆低k集成与EB固化技术

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345721

H. Nagai, K. Maekawa, M. Iwashita, M. Muramatsu, K. Kubota, K. Hinata, T. Kokubo, A. Shiota, M. Hattori, H. Nagano, K. Tokushige, M. Kodera, K. Mishima

引用次数: 1

High speed Si-based optical modulator for on-chip optical interconnects 用于片上光互连的高速硅基光调制器

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345712

D. Marris, A. Lupu, D. Pascal, J. Cercus, L. Vivien, E. Cassan, S. Laval

引用次数: 0

X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films x射线和中子孔隙度测定法是测定多孔低钾薄膜结构特征的有力方法

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345718

Hae-Jeong Lee, B. Vogt, C. Soles, Da-Wei Liu, B. Bauer, Wen-Li Wu, E. Lin, Gwi-Gwon Kang, M. Ko

引用次数: 4

Electrochemically induced defects during post Cu CMP cleaning Cu CMP后清洗过程中电化学诱导缺陷

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345715

W. Chiou, Y.H. Chen, S.N. Lee, S. Jeng, S. Jang, M. Liang

引用次数: 3

Quantitative control of plasma-surface interactions for highly reliable interconnects 用于高可靠互连的等离子体表面相互作用的定量控制

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345698

K. Yatsuda, T. Tatsumi, K. Kawahara, Y. Enomoto, T. Hasegawa, K. Hanada, T. Saito, Y. Morita, K. Shinohara, T. Yamane

引用次数: 1

The application of simultaneous ebeam cure methods for 65 nm node Cu/low-k technology with hybrid (PAE/MSX) structure 同步电子束固化方法在混合(PAE/MSX)结构65 nm节点Cu/低k技术中的应用

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345754

H. Miyajima, K. Fujita, R. Nakata, T. Yoda, N. Hayasaka

引用次数: 6

Carbon nanotube vias for future LSI interconnects 未来大规模集成电路互连的碳纳米管通孔

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345767

M. Nihei, M. Horibe, A. Kawabata, Y. Awano

引用次数: 61

A technique for incorporation of a heatsink for a system utilizing integrated circuits with wireless connections to an off-chip antenna 一种为利用集成电路与片外天线无线连接的系统集成散热片的技术

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345726

Ran Li, Xiaoling Guo, K. O

引用次数: 11

Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect 介质衬垫对Cu/低k互连TDDB寿命的影响

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345692

T. Tsui, P. Matz, R. Willecke, E. Zielinski, Tae Kim, G. Haase, J. McPherson, A. Singh, A. Mckerrow

引用次数: 3

High reliability Cu interconnection utilizing a low contamination CoWP capping layer 采用低污染cop封盖层的高可靠性铜互连

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI: 10.1109/IITC.2004.1345691

T. Ishigami, T. Kurokawa, Y. Kakuhara, B. Withers, J. Jacobs, A. Kolics, I. Ivanov, M. Sekine, K. Ueno

引用次数: 8