2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)最新文献

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Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics 利用设计建模克服人为因素提高电子产品的高可靠性
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423848
G. Caswell, Natalie Hernandez, N. Blattau, C. Hillman
{"title":"Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics","authors":"G. Caswell, Natalie Hernandez, N. Blattau, C. Hillman","doi":"10.23919/NORDPAC.2018.8423848","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423848","url":null,"abstract":"It has been seen on a fairly frequent basis that the selection of components and materials for a design of an electronic product are not the best choices to assure that the product will be capable of functioning for its intended lifetime in its intended environments. This human factor element can be obviated through the use of advanced modeling of the materials, solder joints, printed circuit boards, components and potting compounds (if needed). A high reliability electronic assembly is a complex interaction of materials that depends on the harmonious interface of their various mechanical, thermal, and electrical properties. Identifying and correcting design flaws later in the product development cycle is extremely costly, with the worstcase scenario being discovering design problems after failures occur in the field. Implementing a reliability prediction analysis tool to assess the human factors input to the design will forever change this equation.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127306570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Improving the performance of advertising LED displays by in-mould integration 通过模内集成提高广告LED显示屏的性能
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423852
E. Juntunen, V. Gandhi, Satu Ylimaula, Arttu Huttunen
{"title":"Improving the performance of advertising LED displays by in-mould integration","authors":"E. Juntunen, V. Gandhi, Satu Ylimaula, Arttu Huttunen","doi":"10.23919/NORDPAC.2018.8423852","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423852","url":null,"abstract":"Modern manufacturing technologies of flexible electronics and in-mould integration are used to develop advertising backlights that are thin, lightweight, and preferably dynamic. The result is based on in-mould structural electronics in which the flexible electronics is overmoulded with plastics providing additional features to the display. The technique is used to create optical elements on LED backlighting foils. Also, the effect of embedding on thermal management of the LEDs is studied. Measurements done on different tests structures show benefit in both optical and thermal performance by in-mould integration. The light guide element integrated on the backlighting unit in a single processing step demonstrated 17% advantage in optical power in backlighting application. The thermal measurements show that LED temperatures in the inmould integrated panel reduced on average 20% compared to measurements done on LED foil without embedding.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116076082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Wafer-level Re-Packaging of Commercial Components for Miniaturization and Embedding 商用元件的晶圆级再封装小型化与嵌入
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423859
Jens Müller, Markus Hülsmann, N. Gutzeit, M. Fischer
{"title":"Wafer-level Re-Packaging of Commercial Components for Miniaturization and Embedding","authors":"Jens Müller, Markus Hülsmann, N. Gutzeit, M. Fischer","doi":"10.23919/NORDPAC.2018.8423859","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423859","url":null,"abstract":"Integrated circuits packaged as commercial of the shelf components (COTS) are usually designed for robust handling in standard SMT-processes. They are often too bulky to be embedded in a multilayer PCB and pose limitations for higher component densities on boards. On the other hand, bare dies which could be applied as FlipChip or Chip-on-Board are often not available for customers with medium or low volume products. The suggested technology provides an option to address this issue by a re-packaging process of wire bonded or Au-FlipChip bonded dies in wafer format. Standard packages are mounted and overmolded on a temporary carrier wafer in a matrix like structure. The wafer is thinned down to reduce package height and to get access to wire bonds or stud bumps. Thin film deposition of adhesion layer and plating base followed by polymer photoresist lithography and electroplating is used to create a redistribution pattern which - depending on the area available – can be fan-in or fan-out type. After stripping of the photoresist and etching of the plating base and adhesion layer solder mask and solder bumps may be applied to achieve a SMT-compatible component. Finally, the individual packages are separated by wafer sawing. For packages intended to be used for PCB embedding solder mask and bumping processes are skipped. The entire process is demonstrated based on a Small Outline package with the dimensions 5 mm × 6.3 mm × 1.75 mm (length, width, height). The re-packaged component has a lateral size of 3.2 × 3.2 mm2 and a height of 0.35 mm.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133568023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Multifunctional MMICs – Key Enabler for Future AESA Panel Arrays 多功能mmic -未来AESA面板阵列的关键推动者
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423857
M. Oppermann, R. Rieger
{"title":"Multifunctional MMICs – Key Enabler for Future AESA Panel Arrays","authors":"M. Oppermann, R. Rieger","doi":"10.23919/NORDPAC.2018.8423857","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423857","url":null,"abstract":"Central building blocks for modern phased arrays with Active Electronically Steered Antennas (AESA) are single channel Transmit/Receive (T/R) modules, used in different platforms today, e.g., in antennas for ground surveillance and security radar or in airborne fighter nose radars. Up to hundreds of T/R Modules (TRM) are mounted on so called “plank structures” and with an arrangement of planks the aperture geometry of the AESA is realised perpendicular to the plank direction. Up to now, the receive-, transmit- and control functions of the TRMs typically are realized with single-function GaAs- and Si- MMICs (Monolithic Microwave Integrated Circuit). In order to provide a considerable grating lobe free field of view these brick-style TRMs must fit the half-wavelength grid demand. Therefore the final module width for X-Band usually is limited to 15mm (max). New AESA equipment for UAVs (Unmanned Aerial Vehicles) will have to be integrated in even smaller volumes and often have to match with extremely small hardware-volume and geometry factors, especially with regard to installation depth. Within the last years the development of semiconductor technologies like GaN (Gallium Nitride) and SiGe (Silicon Germanium) have shown a high potential for compact RF solutions by combining several functionalities in one MMIC. HENSOLDT has developed GaN based frontend MMICs including LNA (Low Noise Amplifier), HPA (High Power Amplifier) and SWITCH (replacing the circulator) functionality and SiGe based CoreChips providing both phase- and amplitude setting of the RF signal and control/command and memory functions. With these two multifunctional MMICs and appropriate packaging technologies, the development of a new generation of AESA panel arrays based on tile architecture is rendered possible. Herein the single T/R channels form part of a 3D T/R active zone embedded in an RF multilayer board with the radiating element on its top layer. This modern tile array approach will allow flat antenna solutions with a drastically reduced installation depth.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123088966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors 封装结构的质量保证,包括永久安装的可穿戴传感器的后续洗涤过程
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423849
Heléne Karlsson, O. Lidström, H. Grönqvist, D. Andersson, Jan Wipenmyr, Niina Hernández
{"title":"Quality assurance of encapsulation architecture, including subsequent washing process for permanently mounted wearable sensors","authors":"Heléne Karlsson, O. Lidström, H. Grönqvist, D. Andersson, Jan Wipenmyr, Niina Hernández","doi":"10.23919/NORDPAC.2018.8423849","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423849","url":null,"abstract":"The overall objective of the project wearITmed, Wearable sensors in smart textiles, is to develop a novel wearable sensor system demonstrator. This sensor system aims to monitor symptoms of neurological disorders such as epilepsy, Parkinson’s disease and stroke. The wearable sensor system demonstrator, including both integrated gyros/accelerometers and textile sensors, is useful for the evaluation of clinically relevant movement patterns and other physiological parameters, and further to establish disease discriminating and treatment responsive objective variables. The work presented in this paper is focused on ensuring that the wearable sensor system can be cleaned and washed without first removing the electronics. The work includes three main areas; the adhesion and architecture, the molding and finally the washing test performance. Standard wettability and peel tests (Volvo Standard STD 185–0001) were performed on standard test board IPC-B-5 and IPC-9202 test vehicle for selecting the best adhesive and encapsulation materials in form of an epoxy (Epotek 302–3M) and a medical approved silicone (Nusil MED-6019). The molded components were washtested (Standard SS-EN ISO 6330:2012) followed by testing of the electrical resistance (Standard IPC-9202). As a result a total of 22 garments were produced with four individually mounted boards in each garment. The tests showed that the wearable sensors passed the washing tests and were still functional after 10 repeated washing cycles without any change or degradation in resistance or sign of electrical failure. The wearable electronics therefore meets the requirements of being simultaneously resistant to; water, temperature (40 °C), chemical detergents and dynamic forces.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"18 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130363817","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications 高导热石墨烯薄膜在电子散热应用中的可靠性研究
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423850
Amos Nkansah, Nan Wang, L. Ye, Xitao Wang, Johan Liu
{"title":"Reliability study on high thermally conductive graphene film as heat spreader in electronics cooling applications","authors":"Amos Nkansah, Nan Wang, L. Ye, Xitao Wang, Johan Liu","doi":"10.23919/NORDPAC.2018.8423850","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423850","url":null,"abstract":"Graphene films (GFs) were fabricated and can be applied for dissipating heat from electronics such as portable electronics, laptops, light emitting diodes (LEDs) and other power electronics. These GFs are capable of transporting heat from electronic components. Due to its high thermal conductivity, these GFs are capable to transfer the heat efficiently from electronic component to the heat spreader or heat sink. The cooling failure of the GFs may lead to irreversible damage to the electronic system, hence it is necessary to investigate the long-term reliability of the film under certain harsh conditions. To evaluate the reliability of the GFs, the thermal cycles and moisture test are performed. The effect of temperature cycling (500 cycle) is tested by using an environmental oven with extreme temperatures. The effect of moisture penetration of the GFs is tested for 1024 hours. The thermal conductivity after these two test conditions does not change too much comparing to material before subjecting to test. The electrical conductivity value under the temperature cycling declined by 30% after 500 cycles and that of moisture test was improved by 20%. The result shows that the thermal conductivity of the GFs is quite stable under temperature cycle (500 cycles) and moisture test (1024 hours).","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124683474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Contribution to non-destructive inspection of power semiconductor assemblies by stimulating a lateral heat flow 通过刺激横向热流对功率半导体组件的无损检测做出贡献
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423846
M. Schaulin, U. Nordmeyer, M. Oppermann, T. Zerna
{"title":"Contribution to non-destructive inspection of power semiconductor assemblies by stimulating a lateral heat flow","authors":"M. Schaulin, U. Nordmeyer, M. Oppermann, T. Zerna","doi":"10.23919/NORDPAC.2018.8423846","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423846","url":null,"abstract":"The growing market volume of power electronics during the past years leads to innovative packaging technologies and enhanced requirements on productivity and efficiency and therefore continuous improvement of production processes. There is a need for new or complementary solutions to realize an inline capable diagnostic fitting the quality, reliability and economy requirements. Thermography seems to be a promising approach. It works contact-free and fast and can determine the thermal properties of the package. Previous work has shown that a thermographic inspection of the relevant defects is possible. This paper deals with the improvement of thermographic inspection by laterally stimulated heat flow.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126373048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Plastic QFN Packaging for Space Applications 空间应用的QFN塑料包装
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423851
I. van Dommelen, B. Bonnet, M. Feron, V. Cherman, D. Aguinaga, Mario Gonzalez
{"title":"Plastic QFN Packaging for Space Applications","authors":"I. van Dommelen, B. Bonnet, M. Feron, V. Cherman, D. Aguinaga, Mario Gonzalez","doi":"10.23919/NORDPAC.2018.8423851","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423851","url":null,"abstract":"Sencio has been involved in an EU-funding H2020 project called PAMPA that was finalized last year. The goal of the project was to develop a plastic QFN-packaging solution for RF-components for Space application (Satellites). Today hermetic sealed ceramic and metal can packages are the main assembly technologies applied for space. Besides Sencio the consortium consisted of the following companies; Thales Alenia Space (F), UMS (F), Ikor Technology Centre (ES), IMEC (B).The application of plastic packages has besides cost also an advantage with respect to weight. The main restraint to apply plastic packaging for space was reliability, this was the challenge we took. The outline of the article will be: - the background of the project with basic requirements, - the design of the components and challenges encountered, - the final results.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117065865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Nordpac 2018 TOC
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/nordpac.2018.8423842
{"title":"Nordpac 2018 TOC","authors":"","doi":"10.23919/nordpac.2018.8423842","DOIUrl":"https://doi.org/10.23919/nordpac.2018.8423842","url":null,"abstract":"","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"410 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123094864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Printed Electroluminescent Matrix Display: Implementation Details and Technical Solutions 印刷电致发光矩阵显示器:实现细节和技术解决方案
2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423861
A. Ivanov
{"title":"A Printed Electroluminescent Matrix Display: Implementation Details and Technical Solutions","authors":"A. Ivanov","doi":"10.23919/NORDPAC.2018.8423861","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423861","url":null,"abstract":"Electroluminescence (EL) of commercial phosphor pastes was investigated and an equivalent circuit of the EL stack was determined. The model was used to develop a simple driver electronics capable to operate electroluminescent displays (ELD) with a good contrast and visibility. Flexible displays with a passive matrix of 32 × 5 pixels and up to 11 pictogram elements were produced by screen printing on PET foil and combined with the driver to form a standalone unit. Several demonstrators with the ELDs integrated into a bag or a back pack were manufactured with the primary goal to allow traffic signalling for cyclists or skaters during the dark periods of day; the displays were controlled wirelessly using either a smartphone or a dedicated control device. Present work describes technical implementation details of the printed electroluminescent display and its driving electronics. The following aspects are discussed: empirical model of the EL stack, intensity of emitted light in dependence of driving voltage and frequency, waveforms used for driving the ELD, implemented driver circuit, layout and packaging considerations for the display module.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131037922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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