{"title":"Nordpac 2018 TOC","authors":"","doi":"10.23919/nordpac.2018.8423842","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"410 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/nordpac.2018.8423842","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0