2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)最新文献_第2页

Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles 基于新型导电颗粒的各向同性导电胶的电导率和热传导率

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423853

H. Kristiansen, S. Helland, Erik Kalland, M. A. Ras, C. Grosse

引用次数: 0

Processing of printed silver patterns on an ETFE substrate 在ETFE基板上印刷银图案的加工

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423860

Riikka Mikkonen, S. Lahokallio, L. Frisk, M. Mäntysalo

引用次数: 0

Nordpac 2018 Front cover Nordpac 2018封面

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/nordpac.2018.8423844

引用次数: 0

LTCC Resistors – The Influence of Production Conditions on the Absolute Value and its Reproducibility LTCC电阻器——生产条件对绝对值及其可重复性的影响

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423847

P. Uhlig, A. Serwa, Jens Müller, N. Gutzeit, D. Schwanke, J. Pohlner

{"title":"LTCC Resistors – The Influence of Production Conditions on the Absolute Value and its Reproducibility","authors":"P. Uhlig, A. Serwa, Jens Müller, N. Gutzeit, D. Schwanke, J. Pohlner","doi":"10.23919/NORDPAC.2018.8423847","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423847","url":null,"abstract":"Among other virtues like good microwave performance, high density of integration, good thermal conductivity, hermeticity, and robustness, LTCC technology (Low Temperature Co-fired Ceramic) facilitates the integration of passive components like resistors, capacitors and inductors inside the multilayer stack. This option is further increasing the density of integration and improving RF- and microwave capabilities. However, these components rely on special materials (e.g. resistor paste, high-k dielectrics) which are more sensitive to changes in process parameters than standard LTCC tapes and conductor pastes. This paper focusses on resistors embedded in LTCC. It will describe the DOE (design of experiment) for the comparison of the identical resistor test coupon manufactured in three different sites under the same conditions. The test coupon includes typical resistor dimensions for microwave circuits as well as the dimensions that are used by the material manufacturer to test compliance with specifications. A selection of the measurement results of this extensive comparative study is presented and evaluated.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121493642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/nordpac.2018.8423843

引用次数: 0

Component Packages for IMSE™ (Injection Molded Structural Electronics) IMSE™(注塑结构电子)组件封装

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/nordpac.2018.8423845

Tomi Simula, P. Niskala, M. Heikkinen, O. Rusanen

引用次数: 5

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics 电子产品中无铅焊料系统的腐蚀可靠性

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423855

Feng Li, Vadimas Verdingovas, K. Dirscherl, B. Medgyes, R. Ambat

{"title":"Corrosion Reliability of Lead-Free Solder Systems Used in Electronics","authors":"Feng Li, Vadimas Verdingovas, K. Dirscherl, B. Medgyes, R. Ambat","doi":"10.23919/NORDPAC.2018.8423855","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423855","url":null,"abstract":"The present work investigated the corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys. The first focus was placed on microstructural analysis of the intermetallic compounds (IMCs) formation in the ingots of SAC alloys and their influence on micro galvanic corrosion performance. The microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods. With the potentiostatic technique, the galvanic corrosion has been confirmed between cathodically active Bi phase and anodic (Sn, Sb) solid solution in InnoLot alloy, while the Ag3Sn phase was cathodically active in the other four alloys. In industrial application point of view, the electrochemical migration (ECM) has been reported as the critical issue. Therefore, in order to investigate the ECM susceptibility of five lead-free solder alloys, the study of the solder alloys has been conducted by water droplet (WD) tests on pure alloy ingot samples, and by accelerated humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. A ranking of susceptibility for five alloys has been confirmed by Weibull analysis (63.2% failure rate), leakage current level, and charge transfer over time. The paper theoretically illustrated the reason for the differences in corrosion reliability in the five alloys based on the composition and distribution of IMCs.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"186 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131825619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Water film formation on the PCBA surface and failure occurrence in electronics 电子产品中PCBA表面水膜的形成与故障的发生

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423854

K. Piotrowska, M. Jellesen, R. Ambat

{"title":"Water film formation on the PCBA surface and failure occurrence in electronics","authors":"K. Piotrowska, M. Jellesen, R. Ambat","doi":"10.23919/NORDPAC.2018.8423854","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423854","url":null,"abstract":"The widespread use of no-clean solder flux technology compromises the corrosion reliability of electronics exposed to humid conditions, and can lead to degradation of the device’s lifetime due to the presence of solder flux residues on the Printed Circuit Board Assembly (PCBA) surface after the soldering process. In this work, the effect of hygroscopic flux contamination was assessed in terms of facilitating the water film formation and corrosion on the PCBA surface under varying humidity and temperature conditions. The hygroscopicity of flux residues was evaluated and discussed as a function of flux chemistry and climate conditions for three residue types: adipic acid, glutaric acid, and a binary mixture of adipic:glutaric acids (1:1 ratio). The climatic testing was performed under the relative humidity (RH) conditions varying from 60% to ~99% at 25% and 40% using gravimetric water vapour sorption/desorption and AC electrochemical impedance methods. The corrosivity of flux residues was evaluated through the DC leakage current measurements performed across the interdigitated surface insulation resistance (SIR) comb patterns. The results show that the extent of water layer formation strongly depends on the hygroscopic nature of flux residue, which originates from its chemical structure and temperature. The corrosion occurrence is determined by the residue hygroscopicity and solubility in water. Temperature increase strengthens the residue-moisture interaction, accelerating the formation of water film and corrosion occurrence on the PCBA surface.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130001282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Overload-proof LTCC differential pressure sensors for high temperature applications 用于高温应用的抗过载LTCC压差传感器

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423858

A. Goldberg, Birgit Manhica, S. Ziesche, U. Partsch

引用次数: 0

Screen Printed Conductive Composites with Reduced Graphene Oxide and Silver 还原氧化石墨烯和银的丝网印刷导电复合材料

2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Pub Date : 2018-06-01 DOI: 10.23919/NORDPAC.2018.8423856

Man Song, Jie Zhao, H. Grennberg, Zhi-Bin Zhang

{"title":"Screen Printed Conductive Composites with Reduced Graphene Oxide and Silver","authors":"Man Song, Jie Zhao, H. Grennberg, Zhi-Bin Zhang","doi":"10.23919/NORDPAC.2018.8423856","DOIUrl":"https://doi.org/10.23919/NORDPAC.2018.8423856","url":null,"abstract":"This work provides a method to fabricate conductive composites by screen printing of aqueous hybrid inks with graphene oxide (GO) and silver acetate as silver source. The formulation of the aqueous hybrid inks is realized by mixing highly concentrated GO solution and reactive silver solution, which readily results in a formation of viscous pastes. Composite films with four-probe structure were fabricated by means of blade coating, followed by annealing at 160 °C in air and subsequently at 600 °C in Ar/H2. While the reactive silver solution without GO can be completely reduced when annealed at 90 °C in air, resulting in elemental Ag films with resistivity close to the bulk value, no reduction occurs in the hybrid inks under the same annealing condition. Silver nanoparticles are formed from the hybrid inks at 160 °C and discretely distributed on the reduced GOs (rGOs), which shows a retardation effect of GO on the reduction of silver. Further annealing at 600 °C in Ar/H2 leads to partial restoration of sp2 lattice in the rGOs. The resistivity of the composite films increases as the silver content is increased, which is interpreted by using a percolation model with rGO networks.","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125948561","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2