A. Goldberg, Birgit Manhica, S. Ziesche, U. Partsch
{"title":"Overload-proof LTCC differential pressure sensors for high temperature applications","authors":"A. Goldberg, Birgit Manhica, S. Ziesche, U. Partsch","doi":"10.23919/NORDPAC.2018.8423858","DOIUrl":null,"url":null,"abstract":"This paper present the development of a miniaturized, overload-proof and high-temperature-stable differential pressure sensor in ceramic multilayer technology for requirements in the automotive, aerospace and chemical industries. Currently there is no cost-effective or suitable solution to make on site active signal processing of the relevant parameters pressure and temperature. The main reasons for this are the lack of active high-temperature components (e.g. pressure and temperature transmitters), as well as the missing but necessary high temperature assembly and connection techniques (mechanical structure and electrical contacts >250 °C). Therefore, the aim of the project is to develop an economically viable solution of a high-temperature and overload-resistant ceramic pressure sensor for measurement data at high temperatures (≥300 °C) and to provide these data (high-temperature electronics / AVT).","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/NORDPAC.2018.8423858","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper present the development of a miniaturized, overload-proof and high-temperature-stable differential pressure sensor in ceramic multilayer technology for requirements in the automotive, aerospace and chemical industries. Currently there is no cost-effective or suitable solution to make on site active signal processing of the relevant parameters pressure and temperature. The main reasons for this are the lack of active high-temperature components (e.g. pressure and temperature transmitters), as well as the missing but necessary high temperature assembly and connection techniques (mechanical structure and electrical contacts >250 °C). Therefore, the aim of the project is to develop an economically viable solution of a high-temperature and overload-resistant ceramic pressure sensor for measurement data at high temperatures (≥300 °C) and to provide these data (high-temperature electronics / AVT).