A. Goldberg, Birgit Manhica, S. Ziesche, U. Partsch
{"title":"用于高温应用的抗过载LTCC压差传感器","authors":"A. Goldberg, Birgit Manhica, S. Ziesche, U. Partsch","doi":"10.23919/NORDPAC.2018.8423858","DOIUrl":null,"url":null,"abstract":"This paper present the development of a miniaturized, overload-proof and high-temperature-stable differential pressure sensor in ceramic multilayer technology for requirements in the automotive, aerospace and chemical industries. Currently there is no cost-effective or suitable solution to make on site active signal processing of the relevant parameters pressure and temperature. The main reasons for this are the lack of active high-temperature components (e.g. pressure and temperature transmitters), as well as the missing but necessary high temperature assembly and connection techniques (mechanical structure and electrical contacts >250 °C). Therefore, the aim of the project is to develop an economically viable solution of a high-temperature and overload-resistant ceramic pressure sensor for measurement data at high temperatures (≥300 °C) and to provide these data (high-temperature electronics / AVT).","PeriodicalId":147035,"journal":{"name":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Overload-proof LTCC differential pressure sensors for high temperature applications\",\"authors\":\"A. Goldberg, Birgit Manhica, S. Ziesche, U. Partsch\",\"doi\":\"10.23919/NORDPAC.2018.8423858\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper present the development of a miniaturized, overload-proof and high-temperature-stable differential pressure sensor in ceramic multilayer technology for requirements in the automotive, aerospace and chemical industries. Currently there is no cost-effective or suitable solution to make on site active signal processing of the relevant parameters pressure and temperature. The main reasons for this are the lack of active high-temperature components (e.g. pressure and temperature transmitters), as well as the missing but necessary high temperature assembly and connection techniques (mechanical structure and electrical contacts >250 °C). Therefore, the aim of the project is to develop an economically viable solution of a high-temperature and overload-resistant ceramic pressure sensor for measurement data at high temperatures (≥300 °C) and to provide these data (high-temperature electronics / AVT).\",\"PeriodicalId\":147035,\"journal\":{\"name\":\"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/NORDPAC.2018.8423858\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/NORDPAC.2018.8423858","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Overload-proof LTCC differential pressure sensors for high temperature applications
This paper present the development of a miniaturized, overload-proof and high-temperature-stable differential pressure sensor in ceramic multilayer technology for requirements in the automotive, aerospace and chemical industries. Currently there is no cost-effective or suitable solution to make on site active signal processing of the relevant parameters pressure and temperature. The main reasons for this are the lack of active high-temperature components (e.g. pressure and temperature transmitters), as well as the missing but necessary high temperature assembly and connection techniques (mechanical structure and electrical contacts >250 °C). Therefore, the aim of the project is to develop an economically viable solution of a high-temperature and overload-resistant ceramic pressure sensor for measurement data at high temperatures (≥300 °C) and to provide these data (high-temperature electronics / AVT).