利用设计建模克服人为因素提高电子产品的高可靠性

G. Caswell, Natalie Hernandez, N. Blattau, C. Hillman
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引用次数: 0

摘要

在相当频繁的基础上,电子产品设计的组件和材料的选择并不是确保产品能够在其预期的环境中使用其预期寿命的最佳选择。这种人为因素可以通过使用材料、焊点、印刷电路板、组件和灌封化合物(如果需要)的高级建模来消除。一个高可靠性的电子组件是一个复杂的相互作用的材料,这取决于其各种机械,热学和电学性能的和谐界面。在产品开发周期的后期识别和纠正设计缺陷是非常昂贵的,最坏的情况是在现场发生故障后发现设计问题。实现可靠性预测分析工具来评估设计中的人为因素输入将永远改变这个等式。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics
It has been seen on a fairly frequent basis that the selection of components and materials for a design of an electronic product are not the best choices to assure that the product will be capable of functioning for its intended lifetime in its intended environments. This human factor element can be obviated through the use of advanced modeling of the materials, solder joints, printed circuit boards, components and potting compounds (if needed). A high reliability electronic assembly is a complex interaction of materials that depends on the harmonious interface of their various mechanical, thermal, and electrical properties. Identifying and correcting design flaws later in the product development cycle is extremely costly, with the worstcase scenario being discovering design problems after failures occur in the field. Implementing a reliability prediction analysis tool to assess the human factors input to the design will forever change this equation.
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