Multifunctional MMICs – Key Enabler for Future AESA Panel Arrays

M. Oppermann, R. Rieger
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引用次数: 5

Abstract

Central building blocks for modern phased arrays with Active Electronically Steered Antennas (AESA) are single channel Transmit/Receive (T/R) modules, used in different platforms today, e.g., in antennas for ground surveillance and security radar or in airborne fighter nose radars. Up to hundreds of T/R Modules (TRM) are mounted on so called “plank structures” and with an arrangement of planks the aperture geometry of the AESA is realised perpendicular to the plank direction. Up to now, the receive-, transmit- and control functions of the TRMs typically are realized with single-function GaAs- and Si- MMICs (Monolithic Microwave Integrated Circuit). In order to provide a considerable grating lobe free field of view these brick-style TRMs must fit the half-wavelength grid demand. Therefore the final module width for X-Band usually is limited to 15mm (max). New AESA equipment for UAVs (Unmanned Aerial Vehicles) will have to be integrated in even smaller volumes and often have to match with extremely small hardware-volume and geometry factors, especially with regard to installation depth. Within the last years the development of semiconductor technologies like GaN (Gallium Nitride) and SiGe (Silicon Germanium) have shown a high potential for compact RF solutions by combining several functionalities in one MMIC. HENSOLDT has developed GaN based frontend MMICs including LNA (Low Noise Amplifier), HPA (High Power Amplifier) and SWITCH (replacing the circulator) functionality and SiGe based CoreChips providing both phase- and amplitude setting of the RF signal and control/command and memory functions. With these two multifunctional MMICs and appropriate packaging technologies, the development of a new generation of AESA panel arrays based on tile architecture is rendered possible. Herein the single T/R channels form part of a 3D T/R active zone embedded in an RF multilayer board with the radiating element on its top layer. This modern tile array approach will allow flat antenna solutions with a drastically reduced installation depth.
多功能mmic -未来AESA面板阵列的关键推动者
具有有源电子制导天线(AESA)的现代相控阵的中心构建模块是单通道发射/接收(T/R)模块,目前用于不同的平台,例如用于地面监视和安全雷达的天线或机载战斗机机头雷达。多达数百个T/R模块(TRM)安装在所谓的“木板结构”上,通过木板的排列,AESA的孔径几何形状与木板方向垂直。到目前为止,trm的接收、发射和控制功能通常是用单功能GaAs和Si mmic(单片微波集成电路)来实现的。为了提供一个相当大的光栅无瓣视场,这些砖式trm必须满足半波长网格的要求。因此,x波段的最终模块宽度通常限制在15mm(最大)。用于无人机的新型AESA设备必须集成在更小的体积中,并且通常必须与极小的硬件体积和几何因素相匹配,特别是在安装深度方面。在过去的几年里,半导体技术的发展,如GaN(氮化镓)和SiGe(硅锗),通过在一个MMIC中结合多种功能,显示出紧凑射频解决方案的巨大潜力。HENSOLDT开发了基于GaN的前端mmic,包括LNA(低噪声放大器),HPA(高功率放大器)和SWITCH(取代环行器)功能,以及基于SiGe的CoreChips,提供射频信号的相位和幅度设置以及控制/命令和存储功能。有了这两种多功能mmic和适当的封装技术,基于瓦片结构的新一代AESA面板阵列的开发成为可能。在此,单个T/R通道形成嵌入在射频多层板中的3D T/R有源区的一部分,其顶层上有辐射元件。这种现代瓦片阵列方法将使平面天线解决方案大大减少安装深度。
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