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Electrical Performance of Electronic Packaging - 2004最新文献

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Can we ever send 25-100 Gb/sec signals over 24" line length of printed circuit board and still have mVolt signal at the receiver? 我们是否可以在24”线长的印刷电路板上发送25- 100gb /秒的信号，而接收器上仍然有mVolt的信号?
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407531
B. Bhattacharyya, M. Runstein
{"title":"Can we ever send 25-100 Gb/sec signals over 24\" line length of printed circuit board and still have mVolt signal at the receiver?","authors":"B. Bhattacharyya, M. Runstein","doi":"10.1109/EPEP.2004.1407531","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407531","url":null,"abstract":"We are going to show all the possibilities to achieve a 25-100 Gb/sec point to point signaling scheme for 24 inch channel length, which is made out of a printed circuit board (PCB), two packages, two sockets, and two back plane connectors. It was observed that a mVolt solution (given 1 Volt pulse signal at the transmitter and expected voltage at the receiver, after ISI noise subtracted off >1 mV) exists for 25 Gb/sec signaling scheme while using today's technology for 24 inch channel length. But for 50 and 100 Gb/sec signaling schemes, we do not have a mVolt solution with today's technology (24 inch). We have shown the required value of effective loss and the white noise required (10% of the signal amplitude) to obtain mVolt solution for 24\"length. We have also identified a parameter impacting the I/O performance as we move toward a mVolt and /spl mu/Volt solution.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129773884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages 用于高速印刷电路板和封装的超宽带开关噪声抑制的小型化电磁带隙结构
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407588
S. Shahparnia, O. Ramahi
{"title":"Miniaturized electromagnetic bandgap structures for ultra-wide band switching noise mitigation in high-speed printed circuit boards and packages","authors":"S. Shahparnia, O. Ramahi","doi":"10.1109/EPEP.2004.1407588","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407588","url":null,"abstract":"A novel design for electromagnetic bandgap structures embedded in packages is introduced. This design is able to mitigate switching noise in a power distribution network on an unprecedented range of frequencies, while having a very compact, miniaturized and practical structure.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131449123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
The applications of EBG structures in power/ground plane pair SSN suppression EBG结构在电源/地平面对SSN抑制中的应用
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407587
Guang Chen, K. Melde, J. Prince
{"title":"The applications of EBG structures in power/ground plane pair SSN suppression","authors":"Guang Chen, K. Melde, J. Prince","doi":"10.1109/EPEP.2004.1407587","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407587","url":null,"abstract":"SSN suppression in power delivery systems using electromagnetic band gap structures is discussed. Factors that affect the EBG performance are presented. The performance of a PDS with EBGs and decoupling capacitors is compared to designs with only decoupling capacitors.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"14 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132862028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Companion models of measured/calculated networks via modified cosine series 修正余弦级数的测量/计算网络的伴生模型
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407552
Y. Tanji, H. Asai
{"title":"Companion models of measured/calculated networks via modified cosine series","authors":"Y. Tanji, H. Asai","doi":"10.1109/EPEP.2004.1407552","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407552","url":null,"abstract":"The companion models of measured/calculated networks are proposed using aliasing-free numerical convolution method. As a result, cost of the electromagnetic analysis is much reduced, and numerical robustness of the transient analysis with lumped networks is enhanced. In this work, aliasing-free frequency- to time-domain conversion method is introduced for the numerical convolution based on the modified cosine series.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115282629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Noise reduction in digital/RF daughter card with electromagnetic bandgap layers 具有电磁带隙层的数字/射频子卡的降噪
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407586
S. Rogers, Xin Wu, A. Waltho, D. Xu
{"title":"Noise reduction in digital/RF daughter card with electromagnetic bandgap layers","authors":"S. Rogers, Xin Wu, A. Waltho, D. Xu","doi":"10.1109/EPEP.2004.1407586","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407586","url":null,"abstract":"Small daughterboards representative of radio cards for laptop computers and having digital and RF circuits were fabricated with and without electromagnetic bandgap layers. These layers are shown to significantly reduce power plane noise coupling from the digital circuit to the RF section.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115316335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Comparison between flat spiral and serpentine differential delay lines on TDR and TDT TDR和TDT上扁平螺旋和蛇形差分延迟线的比较
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407569
Wei-De Guo, G. Shiue, R. Wu
{"title":"Comparison between flat spiral and serpentine differential delay lines on TDR and TDT","authors":"Wei-De Guo, G. Shiue, R. Wu","doi":"10.1109/EPEP.2004.1407569","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407569","url":null,"abstract":"In contrast to the commonly employed single delay lines, differential delay lines may alleviate the occurrence of crosstalk and improve the signal integrity. This work investigates the TDR and TDT for differential delay lines with serpentine and flat spiral layout design. The TDR/TDT waveforms and TDT eye diagrams are simulated and presented to investigate the improvement in the signal integrity and noise margin. Signal waveforms and eye diagrams of four basic routing schemes are obtained by the detailed HSPICE simulation. It is found that the combination of differential signaling and flat spiral layout can exhibit the best delay line performance.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126856176","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
IBM BladeCenter system electrical packaging design challenges IBM BladeCenter系统电气封装设计挑战
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407530
P. Patel, J. Hughes, B. Herman, M. Cases, D. de Araujo, N. Pham
{"title":"IBM BladeCenter system electrical packaging design challenges","authors":"P. Patel, J. Hughes, B. Herman, M. Cases, D. de Araujo, N. Pham","doi":"10.1109/EPEP.2004.1407530","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407530","url":null,"abstract":"This work describes the electrical and thermal design challenges encountered during the definition, design and verification of a BladeCenter/spl trade/ system configuration utilizing high speed serial signal interfaces. This system uses gigabit Ethernet (GbE), fiber channel (FC) and Infiniband (IB) interfaces for interconnecting processor blades through high speed cross-bar switches with built-in redundancy capability. A comprehensive electrical design methodology including accurate and detailed modeling and simulation of the complete design space is required to achieve the speeds provided by these standard interfaces using low-cost printed circuit board material. The focus of the analysis is on the link attenuation for the system described. The cooling solution needed to accommodate the overall system thermal requirement for maximum configuration is also discussed.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125223500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Improved method for characterizing transmission lines using frequency-domain measurements 利用频域测量对传输线进行表征的改进方法
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407564
K. S. Oh, Xingchao Yuan
{"title":"Improved method for characterizing transmission lines using frequency-domain measurements","authors":"K. S. Oh, Xingchao Yuan","doi":"10.1109/EPEP.2004.1407564","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407564","url":null,"abstract":"This work presents an improved and accurate methodology for extracting lossy frequency-dependent transmission parameters from S-parameter measurements. The presented technique first uses the multiline method to accurately determine the propagation constant. Then, it proposes a new approach to compute the characteristic impedance by determining the admittance first, based on the fact that the admittance can be modeled as a linear function of frequency. This process ensures both frequency dependent conductor and dielectric losses are accurately determined. It is demonstrated, through several practical examples, that the resulting transmission line parameter is free of common modeling errors at resonant frequencies.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126300767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Efficient and accurate model order reduction of interconnect networks in the presence of incident fields 存在入射场时互连网络的高效准确模型降阶
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407550
T. S. Roseanu, R. Khazaka, P. Gunupudi
{"title":"Efficient and accurate model order reduction of interconnect networks in the presence of incident fields","authors":"T. S. Roseanu, R. Khazaka, P. Gunupudi","doi":"10.1109/EPEP.2004.1407550","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407550","url":null,"abstract":"At high frequencies, interconnects can act as spurious antennas and result in signal degradation. An electromagnetic interference (EMI) analysis is therefore an important part of the design process. In this work an efficient method using projection based model order reduction is presented for efficient EMI analysis of high-speed interconnects. This approach builds on previous advances in model order reduction of transmission line networks and extends them to the case of lines excited by incident fields.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"56 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130533670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Order selection in passive transmission line macromodels based on the Lie decomposition 基于李分解的无源输电线宏观模型阶次选择
Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI: 10.1109/EPEP.2004.1407601
I. Elfadel, H. Huang
{"title":"Order selection in passive transmission line macromodels based on the Lie decomposition","authors":"I. Elfadel, H. Huang","doi":"10.1109/EPEP.2004.1407601","DOIUrl":"https://doi.org/10.1109/EPEP.2004.1407601","url":null,"abstract":"In a passive macromodel for lossy, dispersive multiconductor transmission lines (MTL's) has been proposed. The macromodel uses a multiplicative approximation of the matrix exponential known as the Lie product. The circuit implementation of the macromodel is a cascade of elementary cells, each cell being the combination of a pure delay element and a lumped circuit representing the transmission line losses. Compared with passive rational macromodeling, the Lie product macromodel is capable of efficiently simulating long, low-loss MTL's while preserving passivity. In this paper, we build on the results of and use transmission line theory to derive a new time-domain error criterion for the Lie product macromodel. We also show how this criterion can be used to determine the minimum number of cells needed in the macromodel to guarantee that the magnitude of the time-domain error is below a given engineering tolerance.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132513955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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