IBM BladeCenter system electrical packaging design challenges

P. Patel, J. Hughes, B. Herman, M. Cases, D. de Araujo, N. Pham
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引用次数: 12

Abstract

This work describes the electrical and thermal design challenges encountered during the definition, design and verification of a BladeCenter/spl trade/ system configuration utilizing high speed serial signal interfaces. This system uses gigabit Ethernet (GbE), fiber channel (FC) and Infiniband (IB) interfaces for interconnecting processor blades through high speed cross-bar switches with built-in redundancy capability. A comprehensive electrical design methodology including accurate and detailed modeling and simulation of the complete design space is required to achieve the speeds provided by these standard interfaces using low-cost printed circuit board material. The focus of the analysis is on the link attenuation for the system described. The cooling solution needed to accommodate the overall system thermal requirement for maximum configuration is also discussed.
IBM BladeCenter系统电气封装设计挑战
本工作描述了在定义、设计和验证利用高速串行信号接口的BladeCenter/spl交易/系统配置过程中遇到的电气和热设计挑战。该系统采用千兆以太网(GbE)、光纤通道(FC)和IB (Infiniband)接口,通过具有内置冗余能力的高速交叉排交换机将处理器刀片互连。为了使用低成本的印刷电路板材料实现这些标准接口提供的速度,需要一个全面的电气设计方法,包括对整个设计空间的精确和详细的建模和仿真。分析的重点是所述系统的链路衰减。还讨论了满足最大配置的整个系统热需求所需的冷却解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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